A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.

A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.

A graphene coated silver alloy wire is provided. The composite wire includes a core wire and one to three layers of graphene covering surfaces of the core wire. The core wire is made of a silver-based alloy including 2 to 6 weight percent of palladium. The core wire may be optionally added with 0.01 to 10 weight percent of gold. The invention also includes a manufacturing method immersing the core wire into a solution including graphene oxide and applying bias to the core wire for manufacturing the graphene coated silver alloy wire.