A semiconductor chip includes a substrate including a circuit area having a rectangular shape and a peripheral area surrounding the circuit area, a key area being overlapping a part of the circuit area and a part of the peripheral area, a plurality of drive circuit cells in the circuit area, and a conductive reference line on the peripheral area and extending in a first direction parallel to a first edge among four edges of the rectangular shape of the circuit area.

An LED filament, comprising: an enclosure; a linear array of LED devices; and an electrical connector, wherein: the enclosure includes an optically transmissive binder; and the linear of LED devices is conformally wrapped around by the enclosure to be operable to emit light when energized through the electrical connector.

An LED light bulb includes a bulb shell, a bulb base, a stem, conductive supports, an LED filament, and a supporting arm. The bulb base is connected to the bulb shell. The stem is connected to the bulb base. The conductive supports are connected to the stem. The LED filament includes a filament body and two conductive electrodes. The conductive electrodes are at two ends of the filament body and connected to the conductive supports. The filament body is around the stem. The supporting arm is connected to the stem and the filament body. In a height direction of the LED light bulb, H is a distance from a bottom to a top of the bulb shell. A first height difference is defined between the two conductive electrodes and is from 0 to 1/10H. The filament body is curved to form a highest point and a lowest point. A second height difference is defined between the highest point and the lowest point. The first height difference is less than the second height difference.

Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.

An LED light bulb includes a bulb shell, a bulb base, a stem, conductive supports, an LED filament, and a supporting arm. The bulb base is connected to the bulb shell. The stem is connected to the bulb base. The conductive supports are connected to the stem. The LED filament includes a filament body and two conductive electrodes. The conductive electrodes are at two ends of the filament body and connected to the conductive supports. The filament body is around the stem. The supporting arm is connected to the stem and the filament body. In a height direction of the LED light bulb, H is a distance from a bottom to a top of the bulb shell. A first height difference is defined between the two conductive electrodes and is from 0 to 1/10H. The filament body is curved to form a highest point and a lowest point. A second height difference is defined between the highest point and the lowest point. The first height difference is less than the second height difference.

Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.

A device is provided for interconnecting electronic systems having reference potentials separated by an alternating potential difference, the device includes a plurality of electrical connections that can electrically connect the electronic systems, and inductance coils arranged in series on the electrical connections, the inductance coils being electromagnetically coupled. Also provided is a method for interconnecting electronic systems.

An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.

An integrated circuit (IC) that includes a semiconductor die in an IC package. The semiconductor die includes an electrical endpoint. The IC also includes a pad affixed to the semiconductor die. The pad is characterized by a capacitance and is coupled to the electrical endpoint. The IC also includes a bond wire coupling the pad to an IC package pin. The bond wire is an inductor characterized by an inductance. The inductance is configured to decrease signal degradation caused by the capacitance of the pad on electrical signals transmitted between the pin and the electrical endpoint of the semiconductor die.

In described examples, an integrated circuit comprises: a substrate; a semiconductor die on the substrate; and a device on the substrate and electrically coupled to the semiconductor die, the device including a polymer structure coated with a metal.