A method of improving electrical interconnections between two electrical is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

A packaged semiconductor device includes a first bond pad, a second bond pad, a first bond wire that includes a first end bonded to the first bond pad and a second end bonded to the second bond pad, and a second bond wire that includes a first end that is electrically connected to the first bond pad and a second end that is electrically connected to the second bond pad. The first end of the second bond wire is bonded to the first end of the first bond wire. A method of bonding a bond wire includes bonding a first end of a first bond wire to a contact surface of a first bond pad and bonding a first end of a second bond wire to a surface of the first end of the first bond wire.

Systems, methods, and devices related to techniques for repeating inter-die signals within a multi-die package of a memory device are disclosed. The multi-die package includes a memory stack including a first memory die handling interfacing with a host for the package and at least one second memory die coupled to and configured to communicate with the first memory die via an inter-die connection. A technique involves incorporating the use of a multiplexer positioned in front of the transmitter of each die to facilitate repetition of inter-die signals within the memory stack as needed depending on various factors associated with the memory stack, such as, but not limited to, the type of signal, the intended recipient of the inter-die signals, and the stack height of the memory stack.

Systems, methods, and devices related to techniques for reducing inter-die signal loads within a multi-die package are disclosed. The multi-die package includes a first memory die handling interfacing with a host for the package and at least one second memory die coupled to and configured to communication with the first memory die via an inter-die connection. A technique involves adding an additional wirebond pad to each die in the multi-die package. When the inter-die connections are made, the wirebond pad associated with the first memory die transmitter is connected to the wirebond pad associated with the receiver of a second memory die that is not connected to the transmitter of the second memory die. By not connecting to the transmitter of the second memory die, the first memory die transmits inter-die signals to the second memory die such that a lower signal load is achieved within the multi-die package.

Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.

A semiconductor device includes: a semiconductor substrate; a plurality of first pad electrodes provided above the semiconductor substrate; a plurality of first wires electrically connected to the plurality of first pad electrodes respectively; a first electrode commonly connected to the plurality of first wires; a second pad electrode provided above the semiconductor substrate; and a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode.

A semiconductor package including a substrate including an external terminal; a first semiconductor chip on the substrate and having a first and a second region; at least one second semiconductor chip on the second region of the first semiconductor chip, the at least one second semiconductor chip exposing a top surface of the first region of the first semiconductor chip; and at least one third semiconductor chip on the at least one second semiconductor chip, wherein the first semiconductor chip includes a first pad electrically connected to the at least one second semiconductor chip; a second pad electrically connected to the at least one third semiconductor chip; and a third pad electrically connected to the external terminal, the first pad is on the top surface of the first region, and at least one of the second pad and the third pad is on a top surface of the second region.

A semiconductor stack structure at least includes: a substrate; connection pads located on a surface of the substrate; and a plurality of semiconductor dies located on the surface of the substrate and stacked in sequence in a first direction, the first direction being a thickness direction of the substrate. Each two adjacent semiconductor dies located in a same signal channel are connected to a same connection pad, and two semiconductor dies connected to a same connection pad are respectively located in a first channel region and a second channel region of a signal channel.

A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

A semiconductor device includes: a semiconductor substrate; a plurality of first pad electrodes provided above the semiconductor substrate; a plurality of first wires electrically connected to the plurality of first pad electrodes respectively; a first electrode commonly connected to the plurality of first wires; a second pad electrode provided above the semiconductor substrate; and a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode.