A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.

A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.

An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.

A transfer head, a transfer head array, and a method for transferring an inorganic light-emitting diode are provided. The transfer head for transferring an inorganic light-emitting diode includes a first groove and a second groove. The first groove and the second groove are arranged sequentially in a first direction, and are connected to each other. The first groove is configured to provide an inlet and an outlet for the inorganic light-emitting diode to enter and exit the transfer head. After the inorganic light-emitting diode enters the second groove through the first groove, at least a partial structure of the inorganic light-emitting diode is confined in the second groove. Picking up and transferring the inorganic light-emitting diode is realized by the transfer head with a simple structure.

The present disclosure provides a device transferring apparatus and a device transferring method, comprising: a controlling component and a punching component, the punching component is located at one side of the controlling component; the punching component comprises at least one punching head movable in a first direction; and the controlling component comprises a protruding portion corresponding to the at least one punching head and capable of protruding toward the corresponding punching head, the protruding portion pushes the punching head to move in the first direction by protruding the protruding portion.

A die placement and coupling apparatus may include a die bonding attachment. The die placement and coupling apparatus may include a compliant head unit that may be adapted to optionally couple with a semiconductor die. The compliant head unit may include a die attach surface that may include a layer of compliant material. The layer of compliant material may be coupled to the compliant head unit. The die attach surface may be adapted to mate with the semiconductor die when the semiconductor die is coupled with the compliant head unit. The layer of compliant material may be adapted to yield in response to an applied force. The die placement and coupling apparatus may include a vacuum port in communication with the die attach surface. The port may be adapted to have a vacuum applied to the port, and the vacuum temporarily holds the semiconductor die to the die attach surface.

A die placement and coupling apparatus may include a die bonding attachment. The die placement and coupling apparatus may include a compliant head unit that may be adapted to optionally couple with a semiconductor die. The compliant head unit may include a die attach surface that may include a layer of compliant material. The layer of compliant material may be coupled to the compliant head unit. The die attach surface may be adapted to mate with the semiconductor die when the semiconductor die is coupled with the compliant head unit. The layer of compliant material may be adapted to yield in response to an applied force. The die placement and coupling apparatus may include a vacuum port in communication with the die attach surface. The port may be adapted to have a vacuum applied to the port, and the vacuum temporarily holds the semiconductor die to the die attach surface.

A method for bonding a semiconductor package includes loading a semiconductor chip on a substrate, and bonding the semiconductor chip to the substrate by using a bonding tool, the bonding tool including a pressing surface for pressing the semiconductor chip, and an inclined surface extending from one side of the pressing surface. Bonding the semiconductor chip to the substrate includes deforming a bonding agent disposed between the substrate and the semiconductor chip by pressing the bonding tool, and deforming the bonding agent includes generating a fillet by protruding a portion of the bonding agent beyond the semiconductor chip, and growing the fillet in such a way that a top surface of the fillet is grown in an extending direction of the inclined surface.