Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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H01L2224/75
Apparatus for connecting with bump connectors or layer connectors
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H01L2224/7525
Means for applying energy, e.g. heating means
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H01L2224/753
by means of pressure
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H01L2224/75343
by ultrasonic vibrations
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H01L2224/75347
Piezoelectric transducers
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H01L2224/75349
in the upper part of the bonding apparatus, e.g. in the bonding head
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