A display device includes a base layer including a first portion and a second portion disposed around the second portion; a display unit disposed on a first surface of the first portion and including a light emitting element; a driving circuit disposed on a first surface of the second portion and including a driving chip; a support member attached to a second surface of the first portion and a second surface of the second portion; and an adhesive member disposed between the base layer and the support member, wherein the adhesive member includes a first adhesive member having a first elastic modulus and a second adhesive member having a second elastic modulus that is higher than the first elastic modulus, and the second adhesive member overlaps the driving circuit.

A display device includes a base layer including a first portion and a second portion disposed around the second portion; a display unit disposed on a first surface of the first portion and including a light emitting element; a driving circuit disposed on a first surface of the second portion and including a driving chip; a support member attached to a second surface of the first portion and a second surface of the second portion; and an adhesive member disposed between the base layer and the support member, wherein the adhesive member includes a first adhesive member having a first elastic modulus and a second adhesive member having a second elastic modulus that is higher than the first elastic modulus, and the second adhesive member overlaps the driving circuit.

In one embodiment, an integrated circuit assembly includes a substrate comprising electrical connectors on a top side of the substrate and an integrated circuit die coupled to the top side of the substrate. The integrated circuit die includes metal pillars extending from a bottom side of the die facing the top side of the substrate, and the metal pillars of the integrated circuit die are electrically connected to the electrical connectors of the substrate via a liquid metal (e.g., a Gallium-based alloy).

A semiconductor package includes a lower semiconductor chip disposed on a substrate, at least one upper semiconductor chip disposed on the lower semiconductor chip, a heat spreader bonded on the lower semiconductor chip and the at least one upper semiconductor chip, and an encapsulant surrounding side surfaces of the heat spreader. A lower surface of the heat spreader includes a first protrusion and a non-protruding portion, the first protrusion is in contact with an upper surface of the lower semiconductor chip, and the non-protruding portion is in contact with an upper surface of the at least one upper semiconductor chip.

A semiconductor package includes a lower semiconductor chip disposed on a substrate, at least one upper semiconductor chip disposed on the lower semiconductor chip, a heat spreader bonded on the lower semiconductor chip and the at least one upper semiconductor chip, and an encapsulant surrounding side surfaces of the heat spreader. A lower surface of the heat spreader includes a first protrusion and a non-protruding portion, the first protrusion is in contact with an upper surface of the lower semiconductor chip, and the non-protruding portion is in contact with an upper surface of the at least one upper semiconductor chip.

A display device includes a flexible base layer including a first portion and a second portion disposed around the second portion; a display unit disposed on a first surface of the first portion and including a light emitting element; a driving circuit disposed on a first surface of the second portion and including a driving chip; a support member attached to a second surface of the first portion and a second surface of the second portion; and an adhesive member disposed between the flexible base layer and the support member, wherein the adhesive member includes a first adhesive member having a first elastic modulus and a second adhesive member having a second elastic modulus that is higher than the first elastic modulus, and the second adhesive member overlaps the driving circuit.

A display device includes a flexible base layer including a first portion and a second portion disposed around the second portion; a display unit disposed on a first surface of the first portion and including a light emitting element; a driving circuit disposed on a first surface of the second portion and including a driving chip; a support member attached to a second surface of the first portion and a second surface of the second portion; and an adhesive member disposed between the flexible base layer and the support member, wherein the adhesive member includes a first adhesive member having a first elastic modulus and a second adhesive member having a second elastic modulus that is higher than the first elastic modulus, and the second adhesive member overlaps the driving circuit.

An integrated circuit structure that includes a first integrated circuit package and a second integrated circuit package is described. The two packages can be stacked above, for example, a printed circuit board. The top package is inverted, such that a first die of that top package is facing a second die of the bottom package. A cooling arrangement is in a gap between the first and second integrated circuit packages, and is thermally coupled to the first and second die. The cooling arrangement is to transfer heat generated by a first die of the first integrated circuit package and a second die of the second integrated circuit package. In some cases, structures comprising electrically conductive material (e.g., metal) are encapsulated by a molding compound or insulator, and extend between a first substrate of the first integrated circuit package and a second substrate of the second integrated circuit package.

An integrated circuit structure that includes a first integrated circuit package and a second integrated circuit package is described. The two packages can be stacked above, for example, a printed circuit board. The top package is inverted, such that a first die of that top package is facing a second die of the bottom package. A cooling arrangement is in a gap between the first and second integrated circuit packages, and is thermally coupled to the first and second die. The cooling arrangement is to transfer heat generated by a first die of the first integrated circuit package and a second die of the second integrated circuit package. In some cases, structures comprising electrically conductive material (e.g., metal) are encapsulated by a molding compound or insulator, and extend between a first substrate of the first integrated circuit package and a second substrate of the second integrated circuit package.

A semiconductor device and a semiconductor package including the same are provided. The semiconductor device includes a semiconductor element; a protective layer disposed adjacent to the surface of the semiconductor element, the protective layer defining an opening to expose the semiconductor element; a first bump disposed on the semiconductor element; and a second bump disposed onto the surface of the protective layer. The first bump has a larger cross-section surface area than the second bump.