In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.

A semiconductor device inspection device includes a semiconductor device stage, a sound wave generator, a laser emitter, a photoreceiver, and a processing circuit. The sound wave generator is configured to generate a sound wave having a natural frequency of a bonding wire included in a semiconductor device placed on the semiconductor device stage. The laser emitter is configured to direct laser toward the bonding wire while the sound wave generator generates the sound wave. The photoreceiver is configured to receive the laser reflected by the bonding wire and output a signal corresponding to the received laser. The processing circuit is configured to detect a bonding failure of the bonding wire based on the signal output by the photoreceiver.

Disclosed is a device including a lead frame having a body with a top surface and a bottom surface and lead fingers. Each lead finger has a first end and a second end. A semiconductor die is coupled to the body. A first flag is a first exposed portion of the body and integral with the first end of a first lead finger. The first flag and the first lead finger are a continuous material. A second flag is a second exposed portion of the body and integral with the first end of a second lead finger. The second flag and the second lead finger are a continuous material. An encapsulant covers the die, the bottom surface of the body, the first end of the lead fingers and a portion of the top surface of the body. The flags are separated and electrically isolated from one another by the encapsulant.

In a method of manufacturing a semiconductor device, a semiconductor chip has first and second pads, a passivation film formed such that respective parts of the first and second pads are exposed, a first surface-metal-layer provided on the part of the first pad and a part of the passivation film, and a second surface-metal-layer provided on the part of the second pad and another part of the passivation film. Respective wires are electrically connected to the first and second surface-metal-layers. The semiconductor chip and the respective wires are then sealed with a resin.

In a method of manufacturing a semiconductor device, a semiconductor chip has first and second pads, a passivation film formed such that respective parts of the first and second pads are exposed, a first surface-metal-layer provided on the part of the first pad and a part of the passivation film, and a second surface-metal-layer provided on the part of the second pad and another part of the passivation film. Respective wires are electrically connected to the first and second surface-metal-layers. The semiconductor chip and the respective wires are then sealed with a resin.

Semiconductor packages with electromagnetic interference supported stacked die and a method of manufacture therefor is disclosed. The semiconductor packages may house a stack of dies in a system in a package (SiP) implementation, where one or more of the dies may be wire bonded to a semiconductor package substrate. The dies may be stacked in a partially overlapping, and staggered manner, such that portions of some dies may protrude out over an edge of a die that is below it. This dies stacking may define a cavity, and in some cases, wire bonds may be made to the protruding portions of the die. Underfill material may be provided in the cavity and cured to form an underfill support. Wire bonding of the bond pads overlying the cavity formed by the staggered stacking of the dies may be performed after the formation of the underfill support.

A semiconductor device inspection device includes a semiconductor device stage, a sound wave generator, a laser emitter, a photoreceiver, and a processing circuit. The sound wave generator is configured to generate a sound wave having a natural frequency of a bonding wire included in a semiconductor device placed on the semiconductor device stage. The laser emitter is configured to direct laser toward the bonding wire while the sound wave generator generates the sound wave. The photoreceiver is configured to receive the laser reflected by the bonding wire and output a signal corresponding to the received laser. The processing circuit is configured to detect a bonding failure of the bonding wire based on the signal output by the photoreceiver.

The present invention relates to an electronic unit having at least one first electronic component and one second electronic component that are fastened to a substrate. A shielding is arranged between the first and second electronic components that comprises an elevated portion that projects from a plane defined by the substrate or that extends from its surface, that acts as a shielding and that is formed in one piece with the substrate.

The present invention relates to an electronic unit having at least one first electronic component and one second electronic component that are fastened to a substrate. A shielding is arranged between the first and second electronic components that comprises an elevated portion that projects from a plane defined by the substrate or that extends from its surface, that acts as a shielding and that is formed in one piece with the substrate.

A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.