Electrolyte for a solid-state battery includes a body having grains of inorganic material sintered to one another, where the grains include lithium. The body is thin, has little porosity by volume, and has high ionic conductivity.

Electrolyte for a solid-state battery includes a body having grains of inorganic material sintered to one another, where the grains include lithium. The body is thin, has little porosity by volume, and has high ionic conductivity.

Provided is a semiconductor package including: at least one first substrate including at least one first substrate terminal extended therefrom; at least one second substrate joined to the upper surface of the first substrate using ultrasonic welding; at least one semiconductor chip joined to the upper surface of the second substrate; a package housing covering the at least one semiconductor chip and an area of the second substrate, where ultrasonic welding is performed; and terminals separated from the first substrate, electrically connected to the at least one semiconductor chip through electric signals, and at least one of them is exposed to the outside of the package housing, wherein a thickness of the terminals formed inside the package housing is same as or smaller than a thickness of the first substrate and the second substrate includes at least one embossing groove on the upper surface thereof.

Provided is a semiconductor package including: at least one first substrate including at least one first substrate terminal extended therefrom; at least one second substrate joined to the upper surface of the first substrate using ultrasonic welding; at least one semiconductor chip joined to the upper surface of the second substrate; a package housing covering the at least one semiconductor chip and an area of the second substrate, where ultrasonic welding is performed; and terminals separated from the first substrate, electrically connected to the at least one semiconductor chip through electric signals, and at least one of them is exposed to the outside of the package housing, wherein a thickness of the terminals formed inside the package housing is same as or smaller than a thickness of the first substrate and the second substrate includes at least one embossing groove on the upper surface thereof.

A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.

A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.

An apparatus includes an integrated circuit and a substrate coupled to the integrated circuit. The substrate includes a primary layer having a first surface that is a first external surface of the substrate. The primary layer includes an open area that extends through the primary layer to an inner layer of the substrate. The substrate includes a secondary layer. The inner layer is located between the primary layer and the secondary layer. The inner layer includes a third surface that is orientated approximately parallel to the first surface of the primary layer. A portion of the third surface of the inner layer is exposed via the open area of the primary layer. A first plurality of wire bond pads are disposed on the portion of the third surface of the inner layer that is exposed via the open area of primary layer.

An apparatus includes an integrated circuit and a substrate coupled to the integrated circuit. The substrate includes a primary layer having a first surface that is a first external surface of the substrate. The primary layer includes an open area that extends through the primary layer to an inner layer of the substrate. The substrate includes a secondary layer. The inner layer is located between the primary layer and the secondary layer. The inner layer includes a third surface that is orientated approximately parallel to the first surface of the primary layer. A portion of the third surface of the inner layer is exposed via the open area of the primary layer. A first plurality of wire bond pads are disposed on the portion of the third surface of the inner layer that is exposed via the open area of primary layer.

A package structure is provided. The package structure includes a die, a lead frame, and a conductive glue. The lead frame includes a die pad and a retaining wall structure. The die pad is configured to support the die, and the retaining wall structure surrounds the die. The conductive glue is disposed between the die and the lead frame.

A package structure is provided. The package structure includes a die, a lead frame, and a conductive glue. The lead frame includes a die pad and a retaining wall structure. The die pad is configured to support the die, and the retaining wall structure surrounds the die. The conductive glue is disposed between the die and the lead frame.