Various structures that implement topside metal routing and backside metal routing in combination with vertical transistors are disclosed. The various structures include cells that form inverter devices, NAND devices, and MUX (multiplexer) devices. The disclosed cells include two or four vertical transistors with various connections made to the transistors that include either connected gate logic for inverter and NAND devices or disconnected gate logic for MUX devices.

A layout structure of a standard cell using a complementary FET (CFET) is provided. The standard cell includes a first three-dimensional transistor and a second three-dimensional transistor formed above the first transistor in the depth direction, between buried first and second power supply lines. A first contact connects a local interconnect connected to the first transistor and the first power supply line. A second contact connects a local interconnect connected to the second transistor and the second power supply line. The second contact is longer in the depth direction and greater in size in planar view than the first contact.

A layout structure of a standard cell using a complementary FET (CFET) is provided. The standard cell includes a first three-dimensional transistor and a second three-dimensional transistor formed above the first transistor in the depth direction, between buried first and second power supply lines. A first contact connects a local interconnect connected to the first transistor and the first power supply line. A second contact connects a local interconnect connected to the second transistor and the second power supply line. The second contact is longer in the depth direction and greater in size in planar view than the first contact.

A vertical field effect transistor (VFET) cell implementing a VFET circuit over a plurality of gate grids includes: a 1.sup.st circuit including at least one VFET and provided over at least one gate grid; and a 2.sup.nd circuit including at least one VFET and provided over at least one gate grid formed on a left or right side of the 1.sup.st circuit, wherein a gate of the VFET of the 1.sup.st circuit is configured to share a gate signal or a source/drain signal of the VFET of the 2.sup.nd circuit, and the 1.sup.st circuit is an (X?1)-contacted poly pitch (CPP) circuit, which is (X?1) CPP wide, converted from an X-CPP circuit which is X CPP wide and performs a same logic function as the (X?1)-CPP circuit, X being an integer greater than 1.

A method of manufacturing a semiconductor device includes providing a material above a substrate and respectively forming separate gate electrode lines on opposite sidewalls of the material. As such, a width of cut between the gate electrode lines can be minimized. This shortens a height of cell of the semiconductor device, increasing a cell density of the semiconductor device.

Examples of multi-voltage (MV) complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) based on always-on N-well architecture are described. An MV CMOS IC may include first CMOS cells, second CMOS cells, N-wells and always-on taps. Each first CMOS cell may have a supply terminal configured to receive a local supply voltage, and an N-well (NW) terminal configured to receive a global supply voltage. The second CMOS cells may include always-on CMOS cells. Each second CMOS cell may have a supply terminal configured to receive the global supply voltage, and an NW terminal configured to receive the global supply voltage. The NW terminal of at least one of the second CMOS cells and the NW terminal of at least one of the first CMOS cells may be formed in a first N-well of the one or more N-wells.

A method of manufacturing a semiconductor device includes providing a material above a substrate and respectively forming separate gate electrode lines on opposite sidewalls of the material. As such, a width of cut between the gate electrode lines can be minimized. This shortens a height of cell of the semiconductor device, increasing a cell density of the semiconductor device.

A 3D integrated circuit reduces delay when a signal traverses logical blocks of the integrated circuit. In one instance, the 3D integrated circuit has a first tier and a second tier including one or more first and second logical blocks, respectively. The first logical block(s) include a first primary output logic gate, a first primary input logic gate, a first primary input pin and a first primary output pin. The first primary output pin lies within a perimeter defined by a total area occupied by logic gates of the first logical block(s). The second logical block(s) include a second primary output logic gate, a second primary input logic gate, a second primary input pin and a second primary output pin. The second primary input pin is coupled to the first primary output pin.

Examples of multi-voltage (MV) complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) based on always-on N-well architecture are described. A MV CMOS IC may include first CMOS cells, second CMOS cells, N-wells and always-on taps. Each first CMOS cell may have a supply terminal configured to receive a local supply voltage, and an N-well (NW) terminal configured to receive a global supply voltage. The second CMOS cells may include always-on CMOS cells. Each second CMOS cell may have a supply terminal configured to receive the global supply voltage, and an NW terminal configured to receive the global supply voltage. The NW terminal of at least one of the second CMOS cells and the NW terminal of at least one of the first CMOS cells may be formed in a first N-well of the one or more N-wells.