Embodiments of the invention include a semiconductor device having a fin-shaped channel with a bottom surface, sidewalls and a top surface. A first source or drain (S/D) region is communicatively coupled to the fin-shaped channel, and a sub-channel region is between the bottom surface of the fin-shaped channel and a substrate. A U-shaped dielectric region within a first portion of the sub-channel region, wherein the U-shaped dielectric region includes a bottom isolation layer and a first inner spacer region. A wrap-around gate structure extends around the bottom surface, the sidewalls and the top surface of the fin-shaped channel, wherein a bottom region of the wrap-around gate structure is within a second portion of the sub-channel region.

A self-aligned short-channel SASC electronic device includes a first semiconductor layer formed on a substrate; a first metal layer formed on a first portion of the first semiconductor layer; a first dielectric layer formed on the first metal layer and extended with a dielectric extension on a second portion of the first semiconductor layer that extends from the first portion of the first semiconductor layer, the dielectric extension defining a channel length of a channel in the first semiconductor layer; and a gate electrode formed on the substrate and capacitively coupled with the channel. The dielectric extension is conformally grown on the first semiconductor layer in a self-aligned manner. The channel length is less than about 800 nm, preferably, less than about 200 nm, more preferably, about 135 nm.

Provided is a thin film transistor, including: a base that includes, on an upper surface, a first region and a second region; a gate electrode that is provided on the first region of the base; a gate insulating film that is provided on a surface of the gate electrode and the second region of the base; and a semiconductor layer that is provided on a surface of the gate insulating film, wherein the semiconductor layer includes a third region and a fourth region, in the third region, the semiconductor layer and the gate electrode face with a minimum interval, in the fourth region, a distance from the semiconductor layer to the gate electrode is larger than the minimum interval, and at a boundary position between the third region and the fourth region, the semiconductor layer forms a linear shape or a substantially linear shape.

A light emitting display device includes: a light emitting element; a second transistor connected to a scan line; a first transistor which applies a current to the light emitting element; a capacitor connected to a gate electrode of the first transistor; and a third transistor connected to an output electrode of the first transistor and the gate electrode of the first transistor. Channels of the second transistor, the first transistor, and the third transistor are disposed in a polycrystalline semiconductor layer, and a width of a channel of the third transistor is in a range of about 1 .Math.m to about 2 .Math.m, and a length of the channel of the third transistor is in a range of about 1 .Math.m to about 2.5 .Math.m.

Embodiments include a transistor device that comprises a gate electrode and a gate dielectric surrounding the gate electrode. In an embodiment, a source region may be below the gate electrode and a drain region may be above the gate electrode. In an embodiment, a channel region may be between the source region and the drain region. In an embodiment, the channel region is separated from a sidewall of the gate electrode by the gate dielectric. In an embodiment, a capacitor may be electrically coupled to the drain region.

A transistor with small parasitic capacitance can be provided. A transistor with high frequency characteristics can be provided. A semiconductor device including the transistor can be provided. Provided is a transistor including an oxide semiconductor, a first conductor, a second conductor, a third conductor, a first insulator, and a second insulator. The first conductor has a first region where the first conductor overlaps with the oxide semiconductor with the first insulator positioned therebetween; a second region where the first conductor overlaps with the second conductor with the first and second insulators positioned therebetween; and a third region where the first conductor overlaps with the third conductor with the first and second insulators positioned therebetween. The oxide semiconductor including a fourth region where the oxide semiconductor is in contact with the second conductor; and a fifth region where the oxide semiconductor is in contact with the third conductor.

A display device is provided. The display device includes a base; a gate conductor disposed directly on the base and including a gate line and a gate electrode; a gate insulating layer disposed on the gate conductor and including an overlap portion, which overlaps with the gate conductor, and a non-overlap portion, which is connected to the overlap portion, does not overlap with the gate conductor, and is spaced apart from the base; and a semiconductor pattern disposed on the gate insulating layer and overlapping with the gate electrode, wherein edges of the gate insulating layer project further than edges of the gate conductor and edges of the semiconductor pattern.

After forming a stacked nanowire CMOS device including a first stacked nanowire array laterally surrounded by first epitaxial semiconductor regions, a second stacked nanowire array overlying the first stacked nanowire array and laterally surrounded by second epitaxial semiconductor regions, and a functional gate structure straddling over each semiconductor nanowire in the first and second stacked nanowire arrays, a common source/drain contact structure is formed on one side of the functional gate structure contacting one of the first epitaxial semiconductor regions and one of the second epitaxial semiconductor regions. A first local source/drain contact structure is formed on the opposite side of the functional gate structure contacting another of the first epitaxial semiconductor regions. After forming a trench isolation structure over the first local source/drain contact structure, a second local source/drain structure is formed overlying the first source/drain local contact structure and contacting another of the second epitaxial semiconductor regions.

A semiconductor device and its manufacturing method are provided. The semiconductor device includes a substrate, a semiconductor structure, a gate dielectric layer, and a gate. The semiconductor structure is disposed above the substrate. The semiconductor structure includes two thick portions and a thin portion located between the two thick portions. A thickness of the two thick portions is larger than a thickness of the thin portion. The gate dielectric layer is disposed on the semiconductor structure. The gate is disposed on the gate dielectric layer. A width of the gate is larger than a width of the thin portion, and the gate is overlapped with a part of the two thick portions and the thin portion in a normal direction of a top surface of the substrate. A resistivity of at least a part of the two thick portions gradually increases with proximity to the substrate.

A semiconductor device and its manufacturing method are provided. The semiconductor device includes a substrate, an oxygen-containing protrusive structure disposed above the substrate, a metal oxide layer, a gate dielectric layer disposed on the metal oxide layer, and a gate disposed on the gate dielectric layer. The oxygen-containing protrusive structure has a first surface, a second surface opposite to the first surface, and sidewalls connected to the first and second surfaces. The metal oxide layer includes first, second, and third portions. The first portion covers the first surface. The second portion is connected to the first portion and covers the sidewalls of the oxygen-containing protrusive structure. A resistivity of the second portion gradually decreases away from the first portion. The third portion is connected to the second portion and extends from the sidewalls of the oxygen-containing protrusive structure in a direction away from the oxygen-containing protrusive structure.