A semiconductor package includes: a first semiconductor chip; and a second semiconductor chip connected to the first semiconductor chip, wherein the first semiconductor chip includes: a first semiconductor layer; a first through electrode penetrating the first semiconductor layer; and a first connection pad part positioned on the first semiconductor layer and including a plurality of first connection pads connected to the first through electrode, wherein the second semiconductor chip includes: a second semiconductor layer; a second through electrode penetrating the second semiconductor layer; and a second connection pad part positioned on the second semiconductor layer to face the first connection pad part and including a plurality of second connection pads connected to the second through electrode, wherein the plurality of first connection pads is in contact with the plurality of second connection pads, respectively.

A semiconductor chip with a dual chip-pad structure includes a chip body, a first chip-pad disposed on a first edge of a top surface of the chip body and a second edge of the top surface of the chip body, and a second chip-pad disposed along the second direction at a central portion of the top surface between the first edge of the top surface of the chip body and the second edge of the top surface of the chip body in the first direction. The second edge of the top surface is opposite to the first edge of the top surface in a first direction. The first chip-pad is disposed along a second direction perpendicular to the first direction. The first chip-pad includes a first signal pad coupled with the second chip-pad.