An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

A high-frequency circuit includes: a first substrate; a transmission line formed on the first substrate and having first and second output portions branched from an input portion; a second substrate; first and second pads formed on the second substrate; a first wire connecting the first output portion to the first pad; and a second wire connecting the second output portion to the second pad, wherein an electrical length from the input portion to an edge of the second output portion is longer than an electrical length from the input portion to an edge of the first output portion, and a length from a junction between the second wire and the second output portion to the edge of the second output portion is longer than a length from a junction between the first wire and the first output portion to the edge of the first output portion.

An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

An embodiment of an electronic system may be provided so as to have superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in PCBs coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.