A semiconductor device includes at least one transistor disposed on or in a substrate. The transistor is a bipolar transistor including an emitter, a base, and a collector, or a field-effect transistor including a source, a gate, and a drain. At least one first bump connected to the emitter or the source is disposed on the substrate. Furthermore, at least three second bumps connected to the collector or the drain are disposed on the substrate. In plan view, a geometric center of the at least one first bump is located inside a polygon whose vertices correspond to geometric centers of the at least three second bumps.

Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

The present disclosure, in some embodiments, relates to a bump structure. The bump structure includes a conductive layer and a solder layer. The solder layer is disposed vertically below and laterally between portions of the conductive layer along a cross-section. The conductive layer is continuous between the portions.

A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.

A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.

Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.

A stacked memory device includes: a plurality of semiconductor chips that are stacked and transfer signals through a plurality of through-electrodes, wherein at least one of the semiconductor chips comprises: a re-timing circuit suitable for receiving input signals and first and second clocks, performing a re-timing operation of latching the input signals based on the second clock to output re-timed signals, and reflecting a delay time of the re-timing operation into the first clock to output a replica clock; and a transfer circuit suitable for transferring the re-timed signals to the through-electrodes based on the replica clock.

A lateral power semiconductor device with a metal interconnect layout for low on-resistance. The metal interconnect layout includes first, second, and third metal layers, each of which include source bars and drain bars. Source bars in the first, second, and third metal layers are electrically connected. Drain bars in the first, second, and third metal layers are electrically connected. In one embodiment, the first and second metal layers are parallel, and the third metal layer is perpendicular to the first and second metal layers. In another embodiment, the first and third metal layer are parallel, and the second metal layer is perpendicular to the first and third metal layers. A nonconductive layer ensures solder bumps electrically connect to only source bars or only drain bars. As a result, a plurality of available pathways exists and enables current to take any of the plurality of available pathways.

A lateral power semiconductor device with a metal interconnect layout for low on-resistance. The metal interconnect layout includes first, second, and third metal layers, each of which include source bars and drain bars. Source bars in the first, second, and third metal layers are electrically connected. Drain bars in the first, second, and third metal layers are electrically connected. In one embodiment, the first and second metal layers are parallel, and the third metal layer is perpendicular to the first and second metal layers. In another embodiment, the first and third metal layer are parallel, and the second metal layer is perpendicular to the first and third metal layers. A nonconductive layer ensures solder bumps electrically connect to only source bars or only drain bars. As a result, a plurality of available pathways exists and enables current to take any of the plurality of available pathways.

Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.