H01L2224/24147

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

A display device may include a display area including pixel areas each including an emission area, a non-display area, and a pixel disposed in each of the pixel areas. The pixel may include a first electrode, a second electrode spaced apart from the first electrode and surrounding a periphery of the first electrode, a third electrode spaced apart from the second electrode and surrounding a periphery of the second electrode, a fourth electrode spaced apart from the third electrode and surrounding a periphery of the third electrode, light emitting elements disposed between the first to fourth electrodes, and first and second conductive lines disposed under the first to fourth electrodes with an insulating layer disposed therebetween. The first conductive line may be electrically connected to the first electrode, and the second conductive line may be electrically connected to the fourth electrode.

DISPLAY DEVICE
20220392923 · 2022-12-08 ·

A display device may include a first scan line, a first data line and a second data line, a first read-out line and a second read-out line. A first sub-pixel may be connected to the first scan line, the first data line, and the first read-out line. A second sub-pixel may be connected to the first scan line, the first data line, and the second read-out line. A third sub-pixel may be connected to the first scan line, the second data line, and the first read-out line. Each of the first sub-pixel, the second sub-pixel, and the third sub-pixel may include at least one light emitting element.

PIXEL, DISPLAY DEVICE INCLUDING SAME, AND MANUFACTURING METHOD THEREFOR
20220384402 · 2022-12-01 · ·

A pixel includes first and second sub-pixel areas adjacent to each other in a first direction; first and second electrodes disposed in each of the first and the second sub-pixel areas, and spaced apart from each other; light emitting elements disposed between the first and the second electrodes in each of the first and the second sub-pixel areas; a first driving transistor disposed in the first sub-pixel area, and electrically connected to the first electrode; and a second driving transistor disposed in the second sub-pixel area, and electrically connected to the first electrode. The first electrode of the first sub-pixel area and the first electrode of the second sub-pixel area are electrically disconnected from each other, and the second electrode of the first sub-pixel area and the second electrode of the second sub-pixel area are electrically connected to each other.

DISPLAY DEVICE
20220384401 · 2022-12-01 ·

A display device according to one or more embodiments of the present disclosure includes a substrate, a first electrode and a second electrode on the substrate, a light emitting element electrically connected to the first electrode and the second electrode, and a first reflective layer on the light emitting element and including an opening overlapping the light emitting element, wherein the first reflective layer includes a material having a first reflectivity.

DISPLAY DEVICE

A display device comprises first scan line and a second scan line that extend in a first direction, a third scan line extending in a second direction intersecting the first direction, the third scan line intersecting the first scan line and the second scan line, and an insulating layer including a scan contact hole disposed between the first scan line and the third scan line, and a recess pattern disposed between the second scan line and the third scan line. The scan contact hole passes through the insulating layer in. The first scan line and the third scan line are in electrical contact with each other by the scan contact hole. The recess pattern includes a shape recessed from an upper surface to a lower surface of the insulating layer. The second scan line and the third scan line are electrically insulated from each other.

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

A light emitting element includes: a first semiconductor layer doped with a first polarity; a second semiconductor layer doped with a second polarity different from the first polarity; an active layer between the first semiconductor layer and the second semiconductor layer in a first direction; and an insulating film surrounding an outer surface of at least the active layer and extending in the first direction. A thickness of a first portion of the insulating film surrounding the active layer is in a range of 10% to 16% of a diameter of the active layer.

PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME

A method of forming a redistribution structure includes providing a dielectric layer. The dielectric layer is patterned to form a plurality of via openings. A seed layer is formed on the dielectric layer and filling in the plurality of via openings. A patterned conductive layer is formed a on the seed layer, wherein a portion of the seed layer is exposed by the patterned conductive layer. The portion of the seed layer is removed by using an etching solution, thereby forming a plurality of conductive lines and a plurality of vias. During the removing the portion of the seed layer, an etch rate of the patterned conductive layer is less than an etch rate of the seed layer.

PRINTED DEVICES IN CAVITIES
20230058681 · 2023-02-23 ·

A micro-device structure includes a substrate having a substrate surface and a substrate contact disposed on or in the substrate surface, a cavity extending into the substrate from the substrate surface, a micro-device disposed in the cavity, the micro-device comprising a micro-device contact, a planarization layer disposed over at least a portion of the substrate, and an electrode disposed at least partially over or on the planarization layer and electrically connected to the micro-device contact.

SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR CONVEYING SIGNALS USING THROUGH MOLD VIAS
20230055425 · 2023-02-23 ·

A semiconductor device has first and second dies forming a die stack. Molding material encapsulates the die stack and forms an upper molded surface of the die stack. First conductive traces are coupled to the first die and extend from between the first and second die to corresponding first via locations in the molding material beyond a first side edge of the die stack. Second conductive traces coupled to an active surface of the second die opposite the first die extend to corresponding second via locations. Each first via location is vertically aligned with one of the second via locations. Through mold vias extend through the molding material between vertically aligned via locations to contact with corresponding conductive traces of the first and second dies, while the molding material that extends between the first conductive traces and the upper molded surface is free from any TMV.

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

A display device may include pixels, each of the pixels including first and second lower electrodes disposed on a substrate; first and second upper electrodes respectively disposed on the first and second lower electrodes; a first insulating layer including a first contact hole exposing a portion of the first lower electrode, and a second contact hole exposing a portion of the second lower electrode; a first pixel electrode disposed on the first insulating layer, and contacting the first lower electrode through the first contact hole; a second pixel electrode disposed on the first insulating layer, and contacting the second lower electrode through the second contact hole; and a light emitting element disposed between the first and second upper electrodes. The first and second pixel electrodes may be respectively and electrically connected with the first and second upper electrodes.