A package structure including IPD and method of forming the same are provided. The package structure includes a die, an encapsulant laterally encapsulating the die, a first RDL structure disposed on the encapsulant and the die, an IPD disposed on the first RDL structure and an underfill layer. The IPD includes a substrate, a first connector on a first side of the substrate and electrically connected to the first RDL structure, a guard structure on a second side of the substrate opposite to the first side and laterally surrounding a connector region, and a second connector disposed within the connector region and electrically connected to a conductive via embedded in the substrate. The underfill layer is disposed to at least fill a space between the first side of the IPD and the first RDL structure. The underfill layer is separated from the connector region by the guard structure.

A package structure includes a semiconductor die, an antenna substrate structure, and a redistribution layer. The semiconductor die is laterally wrapped by a first encapsulant. The antenna substrate structure is disposed over the semiconductor die, wherein the antenna substrate structure includes a circuit substrate and at least one antenna element inlaid in the circuit substrate. The redistribution layer is disposed between the semiconductor die and the antenna substrate structure, wherein the at least one antenna element is electrically connected with the semiconductor die through the circuit substrate and the redistribution layer. The at least one antenna element includes patch antennas.

A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a polymer layer and a redistribution layer. The encapsulant laterally encapsulates the die. The polymer layer is on the encapsulant and the die. The polymer layer includes an extending portion having a bottom surface lower than a top surface of the die. The redistribution layer penetrates through the polymer layer to connect to the die.

An electronic circuit device according to the present invention includes a plane-shaped shield member having conductivity, at least one electronic circuit element having a first surface opposed to a second surface on which a connecting part is formed, the first surface arranged on the plane-shaped shield member, a rewiring layer comprises an insulating photosensitive resin layer enclosing the electronic circuit element on the plane-shaped shield member, a plurality of wiring photo vias having a plurality of first conductors electrically connected to a connecting part of the electronic element, a wiring having a second conductor electrically connected to each of the plurality of wiring photo vias on the same surface parallel to the plane-shaped shield member, and a wall-shaped shield groove having a third conductor for a sealing arranged to surround a thickness direction of the electronic circuit element.

A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.

The present disclosure provides a fan-out chip packaging structure and a method to fabricate the fan-out chip package. . The fan-out chip packaging structure includes a first redistribution layer, a second redistribution layer, metal connecting posts, a semiconductor chip, a first packaging layer, a stacked chip package, a passive element, a filling layer, a metal bumps, and a second packaging layer. By means of the present disclosure, various chips having different functions can be integrated into one package structure, thereby improving the integration level of the fan-out packaging structure. By means of the first redistribution layer, the second redistribution layer, and the metal connecting posts, a three-dimensional vertically stacked package is achieved. In this way, the integration level of the packaging structure can be effectively improved, and the conduction path can be effectively shortened, thereby reducing power consumption, increasing the transmission speed, and increasing the data processing capacity.

Disclosed is a semiconductor package comprising a redistribution substrate that has a first trench that extends through a top surface of the redistribution substrate, a first semiconductor chip on the redistribution substrate, a capacitor chip on a bottom surface of the first semiconductor chip, and an under-fill layer on the bottom surface of the first semiconductor chip. The redistribution substrate includes a plurality of dielectric layers vertically stacked, a plurality of redistribution patterns in each of the dielectric layers, and a plurality of dummy redistribution patterns in the first trench. The dummy redistribution patterns vertically overlap the first semiconductor chip. An uppermost surface of the dummy redistribution pattern is located at a level higher than a level of a bottom surface of the first trench.

An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

A semiconductor package is provided. The semiconductor package can include a first redistributed layer on which a plurality of semiconductor chips and a plurality of passive devices are mounted on one surface, a second redistributed layer electrically connected to the first redistributed layer through a via, an external connection terminal formed on the lower surface of the second redistributed layer, a first mold provided to cover the plurality of semiconductor chips and the plurality of passive devices on the first redistributed layer, and a second mold provided between the first redistributed layer and the second redistributed layer. Each of the first redistributed layer and the second redistributed layer includes a wiring pattern and an insulating layer and is composed of a plurality of layers, and at least one of the plurality of semiconductor chips is disposed between the first redistributed layer and the second redistributed layer.

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.