Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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H01L2224/75
Apparatus for connecting with bump connectors or layer connectors
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H01L2224/7525
Means for applying energy, e.g. heating means
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H01L2224/75316

PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME
20170110432 · 2017-04-20 ·

A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing apparatus in which the press fitting head is applied is provided.