A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.

An integrated circuit structure and a chip are provided. The chip includes a first pad set, a second pad set, a connection circuit, and a signal pad set. The first pad set includes a plurality of first pads. The second pad set includes a plurality of second pads respectively corresponding in position to the first pads. Each of the first pads and the corresponding second pad are electrically coupled to each other through the connection circuit so as to be operable by choosing one therefrom. The signal pad set arranged between the first pad set and the second pad set and includes a plurality of signal pads.

A semiconductor package a first package unit comprising a semiconductor chip; and a redistribution structure on the first package unit, wherein the redistribution structure comprises a plurality of wiring lines and a plurality of insulating layers on the plurality of wiring lines, wherein the plurality of wiring lines comprise first subset including a plurality of outermost wiring lines and a second subset, wherein a vertical distance between the plurality of outermost wiring lines and the first package unit is greater than a vertical distance between the second subset of the plurality of wiring lines and the first package unit, a respective surface roughness of each of the plurality of outermost wiring lines is different, and the respective surface roughness of each of the plurality of outermost wiring lines is based on a respective width of each of the plurality of outermost wiring lines in a horizontal direction.

An electronic device is provided. The electronic device includes a base and a semiconductor device. The base has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the base. The semiconductor device has a device edge located within the base in a top view. The base has a unit pad array which is covered by the semiconductor device and electrically connected to the semiconductor device. The unit pad array includes a first pad region composed of a first row and a second row of the unit pad array. The first pad region includes first pads for transmitting commands and addresses to and from the semiconductor device. The first row of the unit pad array is arranged so that it is closer to the device edge than the second row of the unit pad array.

A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

A semiconductor package includes a die pad, a semiconductor die mounted on the die pad, rows of terminal leads disposed around the die pad; a surface mount device (SMD) mounted and bonded with a bond wire in the semiconductor package; and a molding compound encapsulating the semiconductor die and the SMD, the bond wire, and at least partially encapsulating the die pad and the terminal leads. The SMD may be mounted in the semiconductor package by using a non-conductive paste or a conductive paste. The die pad, the tie bars and the terminal leads are coplanar.

A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

An embodiment package-on-package (PoP) device includes a package structure, a package substrate, and a plurality of connectors bonding the package structure to the package substrate. The package structure includes a logic chip bonded to a memory chip, a molding compound encircling the memory chip, and a plurality of conductive studs extending through the molding compound. The plurality of conductive studs is attached to contact pads on the logic chip.

A semiconductor package includes a package substrate, a semiconductor chip, a plurality of conductive bumps and a molding compound. The package substrate has a first surface, a second surface opposite to the first surface, and at least one slot extending from the first surface to the second surface. The semiconductor chip is disposed on the package substrate and includes a chip circuit facing the slot of the package substrate. The conductive bumps are located between the package substrate and the semiconductor chip. The conductive bumps electrically connect the semiconductor chip to the package substrate. The molding compound encapsulates the semiconductor chip and the conductive bumps.