An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

A method of fabricating a semiconductor device is disclosed. The method may include forming an etch-target layer, a mask layer, a blocking layer, and a photoresist layer, which are sequentially stacked on a substrate; forming a photoresist pattern, the forming the photoresist pattern including irradiating the photoresist layer with extreme ultraviolet (EUV) light; forming a mask layer, the forming the mask layer including etching the mask layer using the photoresist pattern as an etch mask; and forming a target pattern, the forming the target pattern including etching the etch-target layer using the mask pattern as an etch mask. The photoresist layer may include an organic metal oxide. The blocking layer may be a non-polar layer and may limit and/or prevent a metallic element in the photoresist layer from infiltrating into the mask layer.

A complementary metal-oxide semiconductor device formed by fabricating CMOS nanosheet stacks, forming a dielectric pillar dividing the CMOS nanosheet stacks, forming CMOS FET pairs on either side of the dielectric pillar, and forming a gate contact for at least one of the FETs.

Provided is an integrated circuit including standard cells arranged over a plurality of rows. The standard cells may include: a plurality of functional cells each implemented as a logic circuit; and a plurality of filler cells including at least one first filler cell and at least one second filler cell that each include at least one pattern from among a back end of line (BEOL) pattern, a middle of line (MOL) pattern, and a front end of line (FEOL) pattern, and wherein the at least one first filler cell and the at least one second filler cell have a same size as each other, and a density of one of the at least one pattern of the at least one first filler cell is different from a density of one of the at least one pattern of the at least one second filler cell.

A method of forming a semiconductor device includes forming a source/drain region on a substrate, depositing a metal-rich metal silicide layer on the source/drain region, depositing a silicon-rich metal silicide layer on the metal-rich metal silicide layer, and forming a contact plug on the silicon-rich metal silicide layer. This disclosure also describes a semiconductor device including a fin structure on a substrate, a source/drain region on the fin structure, a metal-rich metal silicide layer on the source/drain region, a silicon-rich metal silicide layer on the metal-rich metal silicide layer, and a contact plug on the silicon-rich metal silicide layer.

An integrated circuit (IC) with a semiconductor device and an interconnect structure with carbon layers and methods of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a source/drain region on the fin structure, forming a contact structure on the S/D region, forming an oxide layer on the contact structure, forming a conductive carbon line within a first insulating carbon layer on the oxide layer, forming a second insulating carbon layer on the first insulating carbon layer, and forming a via within the second insulating carbon layer.

A forksheet transistor device includes a dual dielectric pillar that includes a first dielectric and a second dielectric that is different from the first dielectric. The dual dielectric pillar physically separates pFET elements from nFET elements. For example, the first dielectric physically separates a pFET gate from a nFET gate while the second dielectric physically separates a pFET source/drain region from a nFET source drain region. When it is advantageous to electrically connect the pFET gate and the nFET gate, the first dielectric may be etched selective to the second dielectric to form a gate connector trench within the dual dielectric pillar. Subsequently, an electrically conductive gate connector strap may be formed within the gate connector trench to electrically connect the pFET gate and the nFET gate.

A complementary field effect transistor (CFET) structure including a first transistor disposed above a second transistor, a first source/drain region of the first transistor disposed above a second source/drain region of the second transistor, wherein the first source/drain region comprises a smaller cross-section than the second source/drain region, a first dielectric material disposed in contact with a bottom surface and vertical surfaces of the first source/drain region and further in contact with a vertical surface and top surface of the second source/drain region, and a second dielectric material disposed as an interlayer dielectric material encapsulating the first and second transistors.

A semiconductor device includes a substrate including PMOSFET and NMOSFET regions, a first gate structure extending in a first direction and crossing the PMOSFET and NMOSFET regions, and a gate contact on and connected to the first gate structure, the gate contact being between the PMOSFET and NMOSFET regions, the gate contact including a first sub contact in contact with a top surface of the first gate structure, the first sub contact including a vertical extending portion extending vertically toward the substrate along one sidewall of the first gate structure, and a second sub contact spaced apart from the first gate structure, a top surface of the second sub contact being positioned at a same level as a top surface of the first sub contact.

An interconnect structure includes a substrate, a dielectric layer on the substrate, a metal interconnect layer in the dielectric layer and in contact with the substrate, the metal interconnect layer having an upper surface flush with an upper surface of the dielectric layer, and a graphene layer on the metal interconnect layer. The graphene layer insulates a metal from air and prevents the metal from being oxidized by oxygen in the air, thereby increasing the queue time for the CMP process and the device reliability.