Reducing a chance of punch-through in a FinFET structure includes providing a substrate, creating a blanket layer of semiconductor material with impurities therein over the substrate, masking a portion of the blanket layer, creating epitaxial semiconductor material on an unmasked portion of the structure, removing the mask, and etching the structure to create n-type raised structure(s) and p-type raised structure(s), a bottom portion of the raised structure(s) being surrounded by isolation material. A middle portion of the raised structure(s) includes a semiconductor material with impurities therein, the middle portion extending across the raised structure(s), and a top portion including a semiconductor material lacking added impurities.

A semiconductor structure includes a well area of first conductive type, which includes: a first device area, where a first active area is formed in the first device area, a first device unit is formed in the first active area and configured to provide a first type driving current; and a second device area, connected to the first device area in a length direction of the well area of first conductive type, where a second active area is formed in the second device area, a second device unit is formed in the second active area and configured to provide a second type driving current. A current value of the second type driving current is greater than a current value of the first type driving current. A width of well area of the first device area is the same as a width of well area of the second device area.

An analog high gain transistor is disclosed. The formation of the analog high gain transistor is highly compatible with existing CMOS processes. The analog high gain transistor includes a double well, which includes the well implants of the low voltage (LV) and intermediate voltage (IV) transistors. In addition, the analog high gain transistor includes light doped extension regions of IV transistor and a thin gate dielectric of the LV transistor.

A method includes forming, over a substrate, a plurality of well taps arranged at intervals in a first direction and a second direction transverse to the first direction. The plurality of well taps is arranged at intervals in a first direction and a second direction transverse to the first direction. The plurality of well taps includes at least one first well tap. The forming the plurality of well taps comprises forming the first well tap by forming a first well region of a first type. The first well region comprises two first end areas and a first middle area arranged consecutively between the two first end areas in the second direction. The forming the first well tap further comprises implanting, in the first middle area, a first dopant of a first type, and implanting, in the first end areas, a second dopant of a second type different from the first type.

A method of manufacturing a semiconductor structure includes: forming a trench in a back side of a substrate; depositing a dopant on surfaces of the trench; forming a shallow trench isolation (STI) structure in a top side of the substrate opposite the trench; forming a deep well in the substrate; out-diffusing the dopant into the deep well and the substrate; forming an N-well and a P-well in the substrate; and filling the trench with a conductive material.

A high voltage complementary metal oxide semiconductor (CMOS) device includes: a semiconductor layer, plural insulation regions, a first N-type high voltage well and a second N-type high voltage well, which are formed by one same ion implantation process, a first P-type high voltage well and a second P-type high voltage well, which are formed by one same ion implantation process, a first drift oxide region and a second oxide region, which are formed by one same etching process by etching a drift oxide layer; a first gate and a second gate, which are formed by one same etching process by etching a polysilicon layer, an N-type source and an N-type drain, and a P-type source and a P-type drain.

An integrated structure of CMOS devices includes: a semiconductor layer, insulation regions, a first high voltage P-type well and a second high voltage P-type well, a first high voltage N-type well and a second high voltage N-type well, a first low voltage P-type well and a second low voltage P-type well, a first low voltage N-type well and a second low voltage N-type well, and eight gates. A CMOS device having an ultra high threshold voltage is formed in ultra high threshold device region; a CMOS device having a high threshold voltage is formed in high threshold device region; a CMOS device having a middle threshold voltage is formed in the middle threshold device region; and a CMOS device having a low threshold voltage is formed in the low threshold device region.

In an aspect of the disclosure, a MOS device for reducing routing congestion caused by using split n-well cells in a merged n-well circuit block is provided. The MOS device may include a first set of cells adjacent to each other in a first direction. The MOS device may include a second set of cells adjacent to each other in the first direction and adjacent to the first set of cells in a second direction. The second set of cells each may include a first n-well, a second n-well, and a third n-well separated from each other. The MOS device may include an interconnect extending in the first direction in the second set of cells. The interconnect may provide a voltage source to the first n-well of each of the second set of cells.

A method for manufacturing a semiconductor device includes providing a substrate structure including a substrate, an interlayer dielectric layer, multiple trenches in the interlayer dielectric layer including first, second, third trenches for forming respective gate structures of first, second, and third transistors, forming an interface layer on the bottom of the trenches; forming a high-k dielectric layer on the interface layer and sidewalls of the trenches; forming a first PMOS work function adjustment layer on the high-k dielectric layer of the third trench; forming a second PMOS work function adjustment layer in the trenches after forming the first PMOS work function adjustment layer; forming an NMOS work function layer in the trenches after forming the second PMOS work function adjustment layer; and forming a barrier layer in the trenches after forming the NMOS work function layer and a metal gate layer on the barrier layer.

A semiconductor device having a zigzag structure, a method of manufacturing the semiconductor device, and an electronic including the semiconductor device. The semiconductor device may include a semiconductor layer (1031) extending in zigzag in a vertical direction with respect to a substrate (1001). The semiconductor layer (1031) includes one or more first portions disposed in sequence and spaced apart from each other in the vertical direction and second portions respectively disposed on and connected to opposite ends of each first portion. A second portion at one end of each first portion extends from the one end in a direction of leaving the substrate, and a second portion at the other end of the each first portion extends from the other end in a direction of approaching the substrate. First portions adjacent in the vertical direction are connected to each other by the same second portion.