A chip includes a first gate extended along a second lateral direction, a first source electrically coupled to a power rail, and a first metal interconnect extended along a first lateral direction approximately perpendicular to the second lateral direction, wherein the first metal interconnect lies above the first gate and the first source, and the first metal interconnect is configured to electrically couple the first gate to the first source. The chip also includes a second gate extended along the second lateral direction, a second source electrically coupled to the power rail, and a second metal interconnect extended along the first lateral direction, wherein the second metal interconnect lies above the second gate and second source, the second metal interconnect is configured to electrically couple the second gate to the second source, and the first metal interconnect is aligned with the second metal interconnect in the second lateral direction.

A standard cell of an IC includes a cell area including a transistor configured to determine a function of the standard cell; a first dummy area and a second dummy area respectively adjacent to two sides of the cell area in a first direction; and an active area extending in the first direction across the cell area, the first dummy area, and the second dummy area. The active area includes a first active area and a second active area spaced apart from each other in a second direction perpendicular to the first direction and extend parallel to each other in the first direction. At least one of the first active area and the second active area provided in the first dummy area is biased, and at least one of the first active area and the second active area provided in the second dummy area is biased.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.

In some examples, an integrated circuit comprises a first plate, a second plate, and a dielectric layer disposed between the first and second plates, the first and second plates and the dielectric layer forming a vertical capacitor, wherein the first and second plates and the dielectric layer of the vertical capacitor are disposed on an isolation region of the integrated circuit.

Aspects disclosed herein include circuits employing a double diffusion break (DDB) and a single diffusion break (SDB) in different type diffusion regions, and related fabrication methods are disclosed. In exemplary aspects disclosed herein, either a DDB or a SDB is formed in the N-type diffusion region(s) and the opposing type diffusion, either a SDB or DDB, is formed in the P-type diffusion region(s). Forming different diffusion breaks between a DDB and a SDB in different diffusion regions of the circuit can be employed to induce channel strain that will increase carrier mobility of either P-type or N-type semiconductor devices formed in respective P-type or N-type diffusion region(s), while avoiding or reducing such induced channel strain in either P-type or N-type semiconductor devices formed in respective P- or N-type diffusion region(s) that may degrade carrier mobility.

According to certain aspects of the present disclosure, a chip includes a first gate, a second gate, a first source, a first source contact disposed on the first source, a metal interconnect above the first source contact and the first gate, a first gate contact electrically coupling the first gate to the metal interconnect, and a first via electrically coupling the first source contact to the metal interconnect. The chip also includes a power rail, and a second via electrically coupling the first source contact to the power rail. The second gate is between the first source and the first gate, and the metal interconnect passes over the second gate.

An integrated circuit device includes a first power rail, a first active area extending in a first direction, and a plurality of gates contacting the first active area and extending in a second direction perpendicular to the first direction. A first transistor includes the first active area and a first one of the gates. The first transistor has a first threshold voltage (VT). A second transistor includes the first active area and a second one of the gates. The second transistor has a second VT different than the first VT. A tie-off transistor is positioned between the first transistor and the second transistor, and includes the first active area and a third one of the gates, wherein the third gate is connected to the first power rail.

A method includes doping a substrate to form a first well region and a second well region having a different conductivity type than the first well region; forming a first fin structure upwardly extending above the first well region and a second fin structure upwardly extending above the second well region; forming a first gate electrode surrounding the first fin structure and a second gate electrode surrounding the second fin structure; forming first source/drain regions adjoining the first fin structure and on opposite sides of the first gate electrode and second source/drain regions adjoining the second fin structure on opposite sides of the second gate electrode; forming an isolation line interposing the first and second gate electrodes and laterally between a first one of the first source/drain regions and a first one of the second source/drain regions.

In some examples, an integrated circuit comprises a first plate, a second plate, and a dielectric layer disposed between the first and second plates, the first and second plates and the dielectric layer forming a vertical capacitor, wherein the first and second plates and the dielectric layer of the vertical capacitor are disposed on an isolation region of the integrated circuit.

An integrated circuit device includes a first device and a second device. The first device is disposed within a first circuit region, the first device including a plurality of first semiconductor strips extending longitudinally in a first direction. Adjacent ones of the plurality of first semiconductor strips are spaced apart from each other in a second direction, which is generally perpendicular to the first direction. The second device is disposed within a second circuit region, the second circuit region being adjacent to the first circuit region in the first direction. The second device includes a second semiconductor strip extending longitudinally in the first direction. A projection of a longitudinal axis of the second semiconductor strip along the first direction lies in a space separating the adjacent ones of the plurality of first semiconductor strips.