Example embodiments provide a four input multiplexer integrated circuit (MXT4) associated with an integrated circuit (IC) and a method for reducing area and power of an integrated circuit (IC) using a MXT4, the MXT4 including a complementary signal generator circuit configured to receive first and second selection signals and to generate first and second complementary selection signals based on respective ones of the first and the second selection signals; and a p-type metal oxide semiconductor (PMOS) and an n-type metal oxide semiconductor (NMOS) stack switch circuit configured to transmit at least one input signal to an output based on the first and the second selection signals and the first and the second complementary selection signals.

Example embodiments provides a full adder integrated circuit (ADDF) for improving area and power of an integrated circuit (IC). The method includes receiving three input signals and generating three corresponding complementary output signals. Further, the method includes generating an internal signal using two complementary output signals out of the generated three corresponding complementary output signals, and one of the three input signals. Further, the method includes generating an output summation signal using a complementary output signal out of the generated three corresponding complementary output signals, the generated internal signal and a complementary internal signal of the generated internal signal. Further, the method includes generating a carry-out signal using two complementary output signal out of the generated three corresponding complementary output signals, the generated internal signal and the complementary internal signal. Example embodiments herein also provide a four input multiplexer Integrated circuit (MXT4) for reducing the area of the IC.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.

Example embodiments provides a full adder integrated circuit (ADDF) for improving area and power of an integrated circuit (IC). The method includes receiving three input signals and generating three corresponding complementary output signals. Further, the method includes generating an internal signal using two complementary output signals out of the generated three corresponding complementary output signals, and one of the three input signals. Further, the method includes generating an output summation signal using a complementary output signal out of the generated three corresponding complementary output signals, the generated internal signal and a complementary internal signal of the generated internal signal. Further, the method includes generating a carry-out signal using two complementary output signal out of the generated three corresponding complementary output signals, the generated internal signal and the complementary internal signal. Example embodiments herein also provide a four input multiplexer Integrated circuit (MXT4) for reducing the area of the IC.

A flip-flop includes a first, second, third and a fourth active region extending in a first direction, and being on a first level of a substrate. The first active region corresponds to a first set of transistors of a first type. The second active region corresponds to a second set of transistors of a second type different from the first type. The third active region corresponds to a third set of transistors of the second type. The fourth active region corresponds to a fourth set of transistors of the first type. The flip-flop further includes a first gate structure extending in the second direction, overlapping at least the second active region and the third active region, and being on a second level different from the first level. The first gate structure is configured to receive a first clock signal.

The semiconductor structure includes a semiconductor substrate having active regions; field-effect devices disposed on the semiconductor substrate, the field-effect devices including gate stacks with elongated shape oriented in a first direction; a first metal layer disposed over the gate stacks, the first metal layer including first metal lines oriented in a second direction being orthogonal to the first direction; a second metal layer disposed over the first metal layer, the second metal layer including second metal lines oriented in the first direction; and a third metal layer disposed over the second metal layer, the third metal layer including third metal lines oriented in the second direction. The first, second, and third metal lines have a first thickness T.sub.1, a second thickness T.sub.2, and t a third thickness T.sub.3, respectively. The second thickness is greater than the first thickness and the third thickness.

An improved standard cell chip, library and/or process ensures that there is adequate spacing between TSCUT jogs and nearby gate contacts to avoid inadvertent shorts/leakages that can degrade manufacturing yield or performance.

A semiconductor device is provided. Gates of first PMOS and NMOS transistors are coupled together for receiving an input signal. Gates of second PMOS and NMOS transistors are coupled together. Gates of third PMOS and NMOS transistors are coupled together. Gates of fourth PMOS and NMOS transistors are coupled together. Drains of fourth PMOS and NMOS transistors are coupled together for providing an output signal. When the first, second, third and fourth NMOS transistors are connected in parallel and the first, second, third and fourth PMOS transistors are connected in parallel, the output signal is provided according to the input signal and a first logic function. When the first and second NMOS transistors are connected in serial and the first and second PMOS transistors are connected in serial, the output signal is provided according to the input signal and a second logic function.

A vertical field effect transistor (VFET) cell implementing a VFET circuit over a plurality of gate grids includes: a 1.sup.st circuit including at least one VFET and provided over at least one gate grid; and a 2.sup.nd circuit including at least one VFET and provided over at least one gate grid formed on a left or right side of the 1.sup.st circuit, wherein a gate of the VFET of the 1.sup.st circuit is configured to share a gate signal or a source/drain signal of the VFET of the 2.sup.nd circuit, and the 1.sup.st circuit is an (X?1)-contacted poly pitch (CPP) circuit, which is (X?1) CPP wide, converted from an X-CPP circuit which is X CPP wide and performs a same logic function as the (X?1)-CPP circuit, X being an integer greater than 1.

An improved standard cell chip, library and/or process ensures that there is adequate spacing between TSCUT jogs and nearby gate contacts to avoid inadvertent shorts/leakages that can degrade manufacturing yield or performance.