Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/10
Bump connectors; Manufacturing methods related thereto
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H01L2224/12
Structure, shape, material or disposition of the bump connectors prior to the connecting process
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H01L2224/13
of an individual bump connector
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H01L2224/13001
Core members of the bump connector
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H01L2224/13198
with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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H01L2224/13499
Shape or distribution of the fillers
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H01L2224/13499

LOW PRESSURE SINTERING POWDER
20240413117 · 2024-12-12 · ·

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 m.

RESIN FLUXED SOLDER PASTE, AND MOUNT STRUCTURE
20170188468 · 2017-06-29 ·

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

PACKAGE STRUCTURE
20250105188 · 2025-03-27 · ·

A package structure is provided. The package structure includes a substrate, a sensing device, a light transmissive member, and a bonding structure. The sensing device is over the substrate, and the light transmissive member is over the sensing device. The bonding structure has an upper surface connected to the light transmissive member and a lower surface connected to the sensing device. A width of the upper surface is less than a width of the lower surface of the bonding structure.

Low Pressure Sintering Powder
20170033073 · 2017-02-02 ·

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 m.

Method for Manufacturing Metal Powder
20170028477 · 2017-02-02 ·

A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.

BONDING ARRANGEMENT HAVING A METAL INVERSE OPALS LAYER
20250364484 · 2025-11-27 · ·

A method of bonding two substrates together includes applying a plurality of templating spheres to a first metal layer on a first substrate of the two substrates, applying a metal on the plurality of templating spheres to form a porous metal layer, and bonding a solder layer arranged on a second substrate of the two substrates to the porous metal layer with heat and pressure such that pores of the porous metal layer are filled with solder material and intermetallic compounds, forming a metal inverse opals layer bonding the first and second substrates together.