A method of visibility event navigation includes receiving, via processing circuitry of a client device, a first visibility event packet from a server, the first visibility event packet including information representing 3D surface elements of an environmental model that are occluded from a first viewcell and not occluded from a second viewcell, the first and second viewcells representing spatial regions of a specified navigational route within a real environment modeled by the environmental model. The method also includes acquiring, surface information representing the visible surfaces of the real environment at a sensor and determining, a position in the real environment by matching the surface information to the visibility event packet information. The method further includes transmitting, the position from the client device to the server and receiving a second visibility event packet from the server if the at least one position is within the specified navigational route.

A method of visibility event navigation includes receiving, via processing circuitry of a client device, a first visibility event packet from a server, the first visibility event packet including information representing 3D surface elements of an environmental model that are occluded from a first viewcell and not occluded from a second viewcell, the first and second viewcells representing spatial regions of a specified navigational route within a real environment modeled by the environmental model. The method also includes acquiring, surface information representing the visible surfaces of the real environment at a sensor and determining, a position in the real environment by matching the surface information to the visibility event packet information. The method further includes transmitting, the position from the client device to the server and receiving a second visibility event packet from the server if the at least one position is within the specified navigational route.

A core material including a core and a solder plating layer of a (SnBi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

A method of visibility event navigation includes receiving, via processing circuitry of a client device, a first visibility event packet from a server, the first visibility event packet including information representing 3D surface elements of an environmental model that are occluded from a first viewcell and not occluded from a second viewcell, the first and second viewcells representing spatial regions of a specified navigational route within a real environment modeled by the environmental model. The method also includes acquiring, surface information representing the visible surfaces of the real environment at a sensor and determining, a position in the real environment by matching the surface information to the visibility event packet information. The method further includes transmitting, the position from the client device to the server and receiving a second visibility event packet from the server if the at least one position is within the specified navigational route.

A method of visibility event navigation includes receiving, via processing circuitry of a client device, a first visibility event packet from a server, the first visibility event packet including information representing 3D surface elements of an environmental model that are occluded from a first viewcell and not occluded from a second viewcell, the first and second viewcells representing spatial regions of a specified navigational route within a real environment modeled by the environmental model. The method also includes acquiring, surface information representing the visible surfaces of the real environment at a sensor and determining, a position in the real environment by matching the surface information to the visibility event packet information. The method further includes transmitting, the position from the client device to the server and receiving a second visibility event packet from the server if the at least one position is within the specified navigational route.

A semiconductor chip, a display device or an electronic device includes a substrate, one or more conductive pads disposed on the substrate, and one or more bumps electrically connected to the one or more conductive pads, in which the one or more bumps includes a metal core, a polymer layer disposed over a surface of the metal core, and a conductive coating layer disposed over a surface of the polymer layer and electrically connected to the one or more conductive pads.

A semiconductor chip, a display device or an electronic device includes a substrate, one or more conductive pads disposed on the substrate, and one or more bumps electrically connected to the one or more conductive pads, in which the one or more bumps includes a metal core, a polymer layer disposed over a surface of the metal core, and a conductive coating layer disposed over a surface of the polymer layer and electrically connected to the one or more conductive pads.

A method is disclosed of fabricating a microelectronic package comprising a substrate overlying the front face of a microelectronic element. A plurality of metal bumps project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. The metal bumps can be wire bonds having first and second ends attached to a same conductive pad of the substrate. A conductive matrix material contacts at least portions of the lateral surfaces of respective ones of the metal bumps and joins the metal bumps with contacts of the microelectronic element.

A method is disclosed of fabricating a microelectronic package comprising a substrate overlying the front face of a microelectronic element. A plurality of metal bumps project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. The metal bumps can be wire bonds having first and second ends attached to a same conductive pad of the substrate. A conductive matrix material contacts at least portions of the lateral surfaces of respective ones of the metal bumps and joins the metal bumps with contacts of the microelectronic element.