Multiple component package structures are described in which an interposer chiplet is integrated to provide fine routing between components. In an embodiment, the interposer chiplet and a plurality of conductive vias are encapsulated in an encapsulation layer. A first plurality of terminals of the first and second components may be in electrical connection with the plurality of conductive pillars and a second plurality of terminals of first and second components may be in electrical connection with the interposer chiplet.

Processing methods may be performed to form a fan-out interconnect structure. The methods may include forming a semiconductor active device structure overlying a first substrate. The semiconductor active device structure may include first conductive contacts. The methods may include forming an interconnect structure overlying a second substrate. The interconnect structure may include second conductive contacts. The methods may also include joining the first substrate with the second substrate. The joining may include coupling the first conductive contacts with the second conductive contacts. The interconnect structure may extend beyond the lateral dimensions of the semiconductor active device structure.

The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.

A semiconductor package includes first semiconductor chips stacked on a package substrate, a lowermost first semiconductor chip of the first semiconductor chips including a recessed region, and a second semiconductor chip inserted in the recessed region, the second semiconductor chip being connected to the package substrate.

An embodiment device includes: a first dielectric layer; a first photonic die and a second photonic die disposed adjacent a first side of the first dielectric layer; a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the first dielectric layer and the second photonic die; a first integrated circuit die and a second integrated circuit die disposed adjacent the first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a second side of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; and a second dielectric layer disposed adjacent the second side of the first dielectric layer.

A package has a package body formed by stacked insulating layers and having a front surface including a mounting area, a back surface and a side surface; a plurality of hollow portions arranged so as to be adjacent to each other on the front surface of the package body; a plurality of electrode pads individually placed on respective bottom surfaces of the hollow portions; and a partition wall formed by at least one insulating layer that forms the package body and having protruding banks at its both edge sides. Surfaces of the electrode pads are located at a lower position with respect to the front surface of the package body. The hollow portions are arranged at opposite sides of the partition wall. The electrode pads are electrically connected to respective conductor layers that are formed on the back surface and/or the side surface of the package body.

A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.

A semiconductor package includes: a semiconductor chip including a front end of line (FEOL) layer and a first back end of line (BEOL) layer disposed on the FEOL layer; and a printed circuit board including a wiring layer and a second BEOL layer disposed on the wiring layer, wherein the semiconductor chip is mounted on the printed circuit board so that the first and second BEOL layers are connected to each other while facing each other, and the second BEOL layer includes a wiring for power transmission.

Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.

A display device includes a display panel including a display area and a non-display area defined therein and including a plurality of signal pads overlapping the non-display area, an electronic component including a base layer with an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps being respectively connected to the signal pads, and a filler disposed between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap the plurality of driving bumps in a plan view.