Reliability of joining between semiconductor chips is improved by promoting filling of a sealing resin into a gap formed between the semiconductor chips. A semiconductor device includes: a first semiconductor chip, which has a plurality of first electrodes on a surface; a second semiconductor chip, which is disposed to be separated by a gap from the surface of the first semiconductor chip, and which includes an inner peripheral area that has a plurality of second electrodes connected to each of the first electrodes on a surface and an outer peripheral area that surrounds the inner peripheral area and has a thickness thinner than the thickness of the inner peripheral area; and a sealing resin, which is respectively filled between the surface of the first semiconductor chip and the inner peripheral area, and between the surface of the first semiconductor chip and the outer peripheral area.

A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.

A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.

A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.

A control unit that controls a motor includes a semiconductor device, the semiconductor device includes a semiconductor package including a plurality of first electrodes, a wiring board including a plurality of second electrodes arranged so as to correspond to each of the plurality of first electrodes, and solder joints connecting the plurality of first electrodes and the plurality of second electrodes, and a tip end of a second electrode arranged at an outermost corner of the wiring board is located outside an outer peripheral end of the semiconductor package.

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die, and a redistribution structure disposed on the first semiconductor die and the insulating encapsulation. The first semiconductor die includes a first contact region and a first non-contact region in proximity to the first contact region. The first semiconductor die includes a first electrical connector disposed on the first contact region and a first dummy conductor disposed on the first non-contact region, and the first electrical connector is electrically connected to a first integrated circuit (IC) component in the first semiconductor die. The first electrical connector is electrically connected to the redistribution structure, and the first dummy conductor is electrically insulated from the first IC component in the first semiconductor die and the redistribution structure.

A flexible display panel, a preparation method thereof and a flexible display device are provided. The flexible display panel includes a flexible substrate; a back protective film arranged on a back surface of the flexible substrate; an adhesive layer arranged between the flexible substrate and the back protective film; and a support structure arranged in the adhesive layer between the flexible substrate and the back protective film and in a position corresponding to each of integrated circuit bumps, the support structure being configured to support the integrated circuit bumps in the adhesive layer.

A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines. The plurality of non-solder electrical connectors includes a corner electrical connector. The corner electrical connector is elongated. An electrical connector is farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated.

A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.