A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

A method for preparing a semiconductor structure includes the steps of providing a substrate; forming a recess over the substrate; disposing a conductive layer over the substrate; and disposing a passivation over the substrate to at least partially cover the conductive layer.

A method for preparing a semiconductor structure includes the steps of providing a substrate; forming a recess over the substrate; disposing a conductive layer over the substrate; and disposing a passivation over the substrate to at least partially cover the conductive layer.

An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.

An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.

A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface and a recess recessed from the first surface towards the second surface; a conductive layer disposed over the first surface and within the recess; and a passivation disposed over the first surface and partially covering the conductive layer, wherein the conductive layer disposed within the recess is exposed from the passivation.

A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface and a recess recessed from the first surface towards the second surface; a conductive layer disposed over the first surface and within the recess; and a passivation disposed over the first surface and partially covering the conductive layer, wherein the conductive layer disposed within the recess is exposed from the passivation.

A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface and a recess recessed from the first surface towards the second surface; a conductive layer disposed over the first surface and within the recess; and a passivation disposed over the first surface and partially covering the conductive layer, wherein the conductive layer disposed within the recess is exposed from the passivation.

A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface and a recess recessed from the first surface towards the second surface; a conductive layer disposed over the first surface and within the recess; and a passivation disposed over the first surface and partially covering the conductive layer, wherein the conductive layer disposed within the recess is exposed from the passivation.

A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.