Provided are integrated circuit packages and methods of forming the same. An integrated circuit package includes an integrated circuit structure, a first die stack and a dummy die. The first die stack includes a plurality of first die structures and is bonded to the integrated circuit structure at a first side of the first die stack. The dummy die includes a plurality of through substrate vias, is located aside the first die stack and is electrically connected to the integrated circuit structure at the first side of the first die stack. In some embodiments, the height of the through substrate vias of the dummy die is the same as the height of the first die stack.

A semiconductor apparatus according to the present invention includes: a semiconductor component including a cell array and a plurality of wirings; and a semiconductor component including a plurality of pads connected to the semiconductor component including the cell array. A first row pad connected to a row wiring connected to a first cell and a second cell, a second row pad connected to a row wiring connected to a third cell and a fourth cell, and a column pad connected to a column wiring connected to the first cell and the third cell are arranged such that a straight line connecting the first row pad and the column pad crosses a straight line connecting the second row pad and the column pad.