Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/39
Structure, shape, material or disposition of the strap connectors after the connecting process
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H01L2224/40
of an individual strap connector
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H01L2224/40151
Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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H01L2224/40221
the body and the item being stacked
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H01L2224/40247
Connecting the strap to a bond pad of the item
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H01L2224/40248
the bond pad being disposed in a recess of the surface of the item
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H01L2224/40248

SEMICONDUCTOR DEVICE COMPRISING A CARRIER, A SEMICONDUCTOR DIE AND A C-SHAPED CLIP CONNECTED BETWEEN THEM
20250201754 · 2025-06-19 · ·

A semiconductor device comprising a carrier, a semiconductor die disposed on the carrier and comprising a first contact pad on a first main face remote from the carrier, and a clip. The clip comprises a horizontal portion, a vertical portion, and a bent-back portion connected with the carrier.