Patent classifications
H01L2224/13387
Method for Manufacturing Metal Powder
A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.
Method for Manufacturing Metal Powder
A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.
Packaged electronic device having reduced parasitic effects and method
In one embodiment, an electronic package includes a substrate having a die pad plurality of lands embedded within substrate encapsulant. An electronic chip including an electronic component is connected to the die pad. The die pad is configured with a recessed well extending from a top surface of the die pad towards a bottom surface of the die pad. The electronic component is position at least proximate to and overlapping the recessed well to increase the distance between the die pad and the electronic component. In one embodiment, the electronic component includes a passive component, such as an inductor. A package body encapsulates the electronic chip and top surfaces of the substrate, and is further disposed within the recessed well. The die pad bottom surface is continuous below the recessed well.
Packaged electronic device having reduced parasitic effects and method
In one embodiment, an electronic package includes a substrate having a die pad plurality of lands embedded within substrate encapsulant. An electronic chip including an electronic component is connected to the die pad. The die pad is configured with a recessed well extending from a top surface of the die pad towards a bottom surface of the die pad. The electronic component is position at least proximate to and overlapping the recessed well to increase the distance between the die pad and the electronic component. In one embodiment, the electronic component includes a passive component, such as an inductor. A package body encapsulates the electronic chip and top surfaces of the substrate, and is further disposed within the recessed well. The die pad bottom surface is continuous below the recessed well.