An electroplating method that is a conventional method has had a problem that it is difficult to manufacture fine pillars without being affected by an undercut. Furthermore, an electroless plating method has had a problem that it is difficult to manufacture pillars having the same shape without any void. The inventors have performed intensive investigations to solve the above problems and, as a result, have found that fine conductive pillars with a high aspect ratio can be readily manufactured on a substrate having an electrode section in such a manner that after a conductive paste containing metal micro-particles is applied in a reduced pressure state, the conductive paste is exposed to standard pressure. The present invention has a particular effect on the manufacture of a metal pillar that is a terminal for flip-chip mounting.

An electroplating method that is a conventional method has had a problem that it is difficult to manufacture fine pillars without being affected by an undercut. Furthermore, an electroless plating method has had a problem that it is difficult to manufacture pillars having the same shape without any void. The inventors have performed intensive investigations to solve the above problems and, as a result, have found that fine conductive pillars with a high aspect ratio can be readily manufactured on a substrate having an electrode section in such a manner that after a conductive paste containing metal micro-particles is applied in a reduced pressure state, the conductive paste is exposed to standard pressure. The present invention has a particular effect on the manufacture of a metal pillar that is a terminal for flip-chip mounting.

The known electrolytic plating method is disadvantageous in that it is difficult to form thin pillars without being influenced by undercuts. The electroless plating method is disadvantageous in that it is difficult to form pillars in the same shape without voids. As a solution to these, the electrically conductive paste according to the present invention for forming pillars is used to make pillars by filling. This helps prevent undercuts, and it is also intended to provide metal pillars in the same shape with good reproducibility. The inventors found that an electrically conductive paste that is very small fine metal particles and contains a particular percentage of fine metal particles is extraordinarily advantageous in forming pillars.

The known electrolytic plating method is disadvantageous in that it is difficult to form thin pillars without being influenced by undercuts. The electroless plating method is disadvantageous in that it is difficult to form pillars in the same shape without voids. As a solution to these, the electrically conductive paste according to the present invention for forming pillars is used to make pillars by filling. This helps prevent undercuts, and it is also intended to provide metal pillars in the same shape with good reproducibility. The inventors found that an electrically conductive paste that is very small fine metal particles and contains a particular percentage of fine metal particles is extraordinarily advantageous in forming pillars.

A technique for fabricating a bump structure is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared, in which the pads includes first conductive material. A metallic adhesion layer is coated on each pad. A bump base is formed on each pad by sintering conductive particles using a mold layer, in which the conductive particles includes second conductive material different from the first conductive material.

A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

A novel packaging method for attached (SMD-type) single small-size and array type chip semiconductor components is disclosed. The configuration of circuit board(s) with double-side interconnections includes reserving two or more connection endpoints on the inner and outer layers of a double-sided circuit board, and interconnecting the circuits on the inner and outer layers by hole drilling and electroplating, such that the two or more connection endpoints on the inner layer are used as inner electrodes for connecting with a semiconductor die, whereas the two or more connection endpoints on the outer layer are used as outer electrodes for SMT soldering.

A novel packaging method for attached (SMD-type) single small-size and array type chip semiconductor components is disclosed. The configuration of circuit board(s) with double-side interconnections includes reserving two or more connection endpoints on the inner and outer layers of a double-sided circuit board, and interconnecting the circuits on the inner and outer layers by hole drilling and electroplating, such that the two or more connection endpoints on the inner layer are used as inner electrodes for connecting with a semiconductor die, whereas the two or more connection endpoints on the outer layer are used as outer electrodes for SMT soldering.

A method of forming a bonding element including a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value, and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.