The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.

A double-sided fluidic oscillator, includes a primary feedback loop unit, a secondary feedback loop unit with two outlet and one inlet, and a common mixing chamber. Two perpendicular oscillator jets operating at different oscillation frequencies produce perpendicular and bi-stable pulsating flow oscillations, simultaneously. The proposed design of the fluidic oscillator is a double-sided fluidic oscillator. Also, disclosed is a method of achieving an enhanced heat and mass transfer by better mixing due to the wide sweeping pattern over a target surface using the double-sided fluidic oscillator.

A rack assembly includes a rack body and a jet generating device. The rack body is configured to hold a plurality of servers that are displaced from each other by a passageway. The jet generating device is disposed in the passageway and includes a partition wall, a proximal barrier, and a distal barrier. The partition wall is disposed to define an inflow path and an outflow path. When cooling air is drawn into the inflow path, the cooling air is blocked by the distal barrier such that the cooling air is forced to flow into the outflow path through internal ports of the partition wall to generate a plurality of cooling air jets, which impinge on and cool one of the servers.

A double-sided fluidic oscillator, includes a primary feedback loop unit, a secondary feedback loop unit with two outlet and one inlet, and a common mixing chamber. Two perpendicular oscillator jets operating at different oscillation frequencies produce perpendicular and bi-stable pulsating flow oscillations, simultaneously. The proposed design of the fluidic oscillator is a double-sided fluidic oscillator. Also, disclosed is a method of achieving an enhanced heat and mass transfer by better mixing due to the wide sweeping pattern over a target surface using the double-sided fluidic oscillator.

A rack assembly includes a rack body and a jet generating device. The rack body is configured to hold a plurality of servers that are displaced from each other by a passageway. The jet generating device is disposed in the passageway and includes a partition wall, a proximal barrier, and a distal barrier. The partition wall is disposed to define an inflow path and an outflow path. When cooling air is drawn into the inflow path, the cooling air is blocked by the distal barrier such that the cooling air is forced to flow into the outflow path through internal ports of the partition wall to generate a plurality of cooling air jets, which impinge on and cool one of the servers.