A burnishing machine is provided in which both sides of a groove is machined by a single tool without changing the movement direction of a piston. The burnishing machine, includes: a tip configured to press and process a process face; and a pressurizing unit configured to press the tip against the process face, the pressurizing unit including, a piston configured to reciprocate in a direction orthogonal to the tip, a cylinder portion that accommodates the piston such that the piston reciprocates; and a pressurizing mechanism configured to urge the tip to the process face at both timing of pushing the tip against the process face and pulling the tip against the process face by making the piston reciprocate.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

A burnishing machine is provided in which both sides of a groove is machined by a single tool without changing the movement direction of a piston.

The burnishing machine, includes: a tip configured to press and process a process face; and a pressurizing unit configured to press the tip against the process face, the pressurizing unit including, a piston configured to reciprocate in a direction orthogonal to the tip, a cylinder portion that accommodates the piston such that the piston reciprocates; and a pressurizing mechanism configured to urge the tip to the process face at both timing of pushing the tip against the process face and pulling the tip against the process face by making the piston reciprocate.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Disclosed herein are biodegradable medical devices comprising biodegradable materials (e.g., magnesium-calcium alloys) having an adjustable rate of degradation that can be used in various applications including, but not limited to, drug delivery applications, cardiovascular applications, and orthopedic applications to make biodegradable and biocompatible devices. Also disclosed herein are methods of making biodegradable medical devices comprising biodegradable materials by using, for instance, hybrid dry cutting/hydrostatic burnishing.

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.