Embodiments of mechanisms for processing a semiconductor wafer are provided. A method for processing a wafer includes providing a wafer process apparatus. The wafer process apparatus includes a chamber and a stage positioned in the chamber for supporting the semiconductor wafer. The method also includes supplying a process gas to the semiconductor wafer via a discharged assembly that is adjacent to the stage. The discharged assembly includes a discharged passage configured without a vertical flow path section.

An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.

An emergency release mechanism is applied to fluid loading equipment for transporting fluid, and includes: a pair of pipe portions having a vacuum double structure in each of which a flow path for transporting the fluid is formed, the pair of pipe portions being arranged with opening ends abutting against each other; a coupling member capable of coupling the pair of pipe portions to each other and being removed therefrom; and a pair of shutoff valves configured to shut off the flow path in the pipe portions. The pair of pipe portions respectively include valve seats formed in the flow path. The shutoff valves respectively include valve bodies configured to seat on the respective valve seats to close the flow path, and linear motion drive devices configured to move the respective valve bodies along the flow path to cause the valve bodies to seat on the respective valve seats.

A valve device that includes a housing; an inlet passage disposed inside the housing and into which a fluid is introduced; a first discharging unit disposed at a downstream end of the inlet passage; an outlet passage disposed inside the housing, communicating with the first discharging unit, extending in a direction different from the inlet passage, and configured to discharge the fluid outside; a communication chamber disposed between the first discharging unit and the outlet passage and communicating with these members; a valve seat disposed on the first discharging unit; a valve body configured to contact the valve seat to open and close the first discharging unit; a heater; and a heat transfer plate disposed inside the housing, extending along the inlet passage, and configured to transfer heat from the heater to the fluid. The inlet passage may approach closer to the outlet passage toward the first discharging unit side.