A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

The invention relates to an adhesive composition comprising at least one natural latex and at least one polymeric composition having a glass transition temperature ranging from 50 C. to 0 C. The invention also relates to a membrane obtained after drying the adhesive composition according to the invention, to a combination of a flexible surface coating with an adhesive composition according to the invention, to a method for applying a flexible surface coating onto a substrate as well as a substrate coated with a peelable adhesive membrane according to the invention.

A facility 300 for separation of layers in a multilayer system 310. The facility 300 comprises one or more baths 320a, 320b for accepting the multilayer system 310 and a dispenser 330 for providing a separation fluid 340. The separation fluid 340 comprises a nanoscale dispersion for washing the multilayer system in the baths 320a, 320b and is described in more details below. The facility 300 also includes a filtration device 350 for filtering separated undissolved components of the multilayer system 310.

A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.

Multilayered polymer films are configured so that successive constituent layer packets can be delaminated in continuous sheet form from the remaining film. The films are compatible with known coextrusion manufacturing techniques, and can be made without adhesive layers between layer packets that are tailored to be individually peelable from the film. Instead, combinations of polymer compositions are used to allow non-adhesive polymer layers to be combined such that irreversible delamination of the film is likely to occur at interfaces between layer packet pairs. Some polymer layers, including at least one embedded layer, may include an ultraviolet (UV) light stabilizer such as a UV absorber, antioxidant, or hindered amine light stabilizer (HALS), and these layers may be positioned at the front of each layer packet. After the UV-stabilized layer of one packet has been used, the packet can be peeled away to expose a new UV-stabilized layer of the next layer packet.

Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

A display laminate which includes a front electrode layer, a display material layer and a protective film layer, wherein the protective film layer and the display material layer are narrower than the front electrode layer and wherein the protective film layer and the display material layer have a common edge with the front electrode layer on a first side and a common edge with each other but not with the front electrode layer on an opposite side.

A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.

An elastic nonwoven laminate that contains an elastic film laminated to one or more nonwoven facings is provided. The nonwoven facing contains a conventional polyolefin and can also contain a polyolefin-based plastomer. The laminate is activated by grooving to decouple the nonwoven facing from the elastic film. To reduce fiber-pull out that can result due to activation by grooving, the laminate can be post-bonded at room or elevated temperatures and a specific range of pressures to compact the fibers of the facing and minimize fiber pull-out/fuzziness while not sacrificing the softness, elasticity, and feel of the laminate.

A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.