Patent classifications
Y10T156/14
Methods for joining polymeric composites using a hybrid friction/ultrasound technique for achieving desired weld characteristics
A method for use in efficiently joining together multiple workpieces to inhibit establishment of weld material in unwanted areas. The method uses a hybrid shaping-and-energizing system having a shaping tool and an ultrasonic horn. The method positions the hybrid shaping-and-energizing system proximate a workpiece, uses the shaping tool to form at least one recess in the proximate workpiece, and applies weld energy to the proximate workpiece using the ultrasonic horn. The recess is formed and the weld energy applied such that molten workpiece material becomes disposed within the recess, thereby inhibiting formation of weld material in the unwanted areas.
SYSTEMS AND METHOD FOR PRODUCING THREE-DIMENSIONAL ARTICLES FROM FLEXIBLE COMPOSITE MATERIALS
The present disclosure encompasses three-dimensional articles comprising flexible-composite materials and methods of manufacturing said three-dimensional articles. More particularly, the present system relates to methods for manufacturing seamless three-dimensional-shaped articles usable for such finished products as airbags/inflatable structures, bags, shoes, and similar three-dimensional products. A preferred manufacturing process combines composite molding methods with specific precursor materials to form fiber-reinforced continuous shaped articles that are flexible and collapsible.
METHODS FOR JOINING POLYMERIC COMPOSITES USING A HYBRID FRICTION/ULTRASOUND TECHNIQUE FOR ACHIEVING DESIRED WELD CHARACTERISTICS
A method for use in efficiently joining together multiple workpieces to inhibit establishment of weld material in unwanted areas. The method uses a hybrid shaping-and-energizing system having a shaping tool and an ultrasonic horn. The method positions the hybrid shaping-and-energizing system proximate a workpiece, uses the shaping tool to form at least one recess in the proximate workpiece, and applies weld energy to the proximate workpiece using the ultrasonic horn. The recess is formed and the weld energy applied such that molten workpiece material becomes disposed within the recess, thereby inhibiting formation of weld material in the unwanted areas.
Apparatus and method for wafer level bonding
A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by one or more shared flexible membranes. The method also includes setting a first profile of the surface of the first wafer chuck. Setting a first profile of the surface of the first wafer chuck includes adjusting a first volume of a first profile control zone of the multiple first profile control zones. Setting a first profile of the surface of the first wafer chuck also includes adjusting a second volume of a second profile control zone of the multiple first profile control zones, the first volume of the first profile control zone being adjusted independently from the second volume of the second profile control zone, and the second adjustable volume encircling the first adjustable volume.
Systems and method for producing three-dimensional articles from flexible composite materials
The present disclosure encompasses three-dimensional articles comprising flexible-composite materials and methods of manufacturing said three-dimensional articles. More particularly, the present system relates to methods for manufacturing seamless three-dimensional-shaped articles usable for such finished products as airbags/inflatable structures, bags, shoes, and similar three-dimensional products. A preferred manufacturing process combines composite molding methods with specific precursor materials to form fiber-reinforced continuous shaped articles that are flexible and collapsible.
Apparatus and methods for joining polymeric composites using a hybrid friction/ultrasound technique for achieving desired weld characteristics
A hybrid shaping-and-energizing system, for use in efficiently joining together multiple workpieces while inhibiting establishment of weld material in unwanted areas. The system including a shaping tool configured to form at least one recess in a proximate workpiece of the workpieces to be joined, and a weld-energy applicator connected to the shaping tool and configured to apply weld energy to the proximate workpiece. The recess is formed, and weld energy applied, so that molten workpiece material becomes disposed within the recess, thereby inhibiting formation of weld material in any undesired position.
Wire label with carrier
A label assembly comprised of a carrier strip and a plurality of labels. The carrier strip comprises at least a first backing layer and a layer of adhesive material located over said first backing layer. A second backing layer may be located over said adhesive layer. Predetermined areas are removed from the second backing area to expose the adhesive layer. Cover tabs overlay portions of the exposed adhesive layer with the labels being removably adhered to the carrier strip on the remaining exposed adhesive layer. The labels may be provided with frangible regions for partitioning the wire label. The frangible regions include both severed portions and points of attachment.
PROCESS FOR LAMINATING WORKS TOGETHER
An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.
APPARATUS AND METHOD FOR WAFER LEVEL BONDING
A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by one or more shared flexible membranes. The method also includes setting a first profile of the surface of the first wafer chuck. Setting a first profile of the surface of the first wafer chuck includes adjusting a first volume of a first profile control zone of the multiple first profile control zones. Setting a first profile of the surface of the first wafer chuck also includes adjusting a second volume of a second profile control zone of the multiple first profile control zones, the first volume of the first profile control zone being adjusted independently from the second volume of the second profile control zone, and the second adjustable volume encircling the first adjustable volume.
Three-dimensional reuseable curing caul for use in curing integrated composite components and methods of making the same
Curing cauls formed of a one-piece three-dimensional resiliently shape-retentive fiber-reinforced body are provided, whereby the body includes a fibrous sheet coated with at least one layer of a cured elastomeric resin. The fibrous sheet may be embedded within the cured elastomeric resin, with the body having a stiffened perimetrical edge region and a stiffened ridge region vertically spaced from the edge region.