A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.

Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

A display laminate which includes a front electrode layer, a display material layer and a protective film layer, wherein the protective film layer and the display material layer are narrower than the front electrode layer and wherein the protective film layer and the display material layer have a common edge with the front electrode layer on a first side and a common edge with each other but not with the front electrode layer on an opposite side.

A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.

A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.

A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.

The apparatus includes an operating unit, which can be a welding unit for welding a closing film to an edge zone of a containing element or a separating unit for separating containing elements from portions of sheet material. The apparatus includes a control unit programmed to enable the operating unit to selectively process a continuous strip of containing elements or discrete groups of containing elements.

A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.

The apparatus includes an operating unit, which can be a welding unit for welding a closing film to an edge zone of a containing element or a separating unit for separating containing elements from portions of sheet material. The apparatus includes a control unit programmed to enable the operating unit to selectively process a continuous strip of containing elements or discrete groups of containing elements.

A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.