Disclosed is a tool system including a drive for driving a tool holder including an electromagnetic generator for generating electrical energy from inertial energy of the tool holder. The tool holder may be driven in rotation, wherein the electromagnetic generator comprises a rotor part, which is rotatably mounted on the tool holder, and a stator part on the tool holder cooperating with each other for generating a voltage by electromagnetic induction. Alternatively, an axially movable inertial mass can be used for utilization of an oscillating linear movement.

A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

An apparatus and an associated method. The apparatus includes a chuck in a process chamber, an array of three or more ultrasonic sensors in the process chary a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.

The invention relates to a device controlling a chuck of a machine tool and an auxiliary equipment thereof, thereby facilitating a setup work. Gripping and releasing of a work are confirmed by registering a work gripping position and a work releasing position of a chuck, a kind of a used chuck, and a gripping direction of a work in an external memory device every product type of the work, transferring the work gripping position and the work releasing position in correspondence to the product type to a controller of a machine tool displaying them on a display of an operator control panel, detecting a position of an operation rod opening and closing a claw of the chuck by a stroke sensor, referring to the gripping position of the work, and detecting conformity of the detecting position and set values of the work gripping position and the work releasing position.

A live tool system having a live tool and a collar surrounding a rotating shaft or a rotating cutting tool of the live tool. The collar houses at least one sensor capable of monitoring an operating condition proximate to the cutting tool during a cutting operation. Example operating conditions including temperature and vibration. The system also includes a wireless transmitter in communication with the at least one sensor for transmitting a signal for use by a machining center controller.

An apparatus and method for centering substrates determining on a chuck. The apparatus includes a chuck in a process chamber, the chuck configured to removeably hold a substrate for processing; an array of two or more ultrasonic sensors arranged in the process chamber, each ultrasonic sensor arranged relative to the chuck so as to send a respective ultrasonic sound wave to a respective preselected region of the substrate and receive a respective return ultrasonic sound wave from the preselected region of the substrate; and a controller connected to each ultrasonic sensor and configured to compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave from each ultrasonic sensor.

A chuck, a system including a chuck and a method for making a semiconductor device are disclosed. In one embodiment the chuck includes a first conductive region configured to be capacitively coupled to a first RF power generator, a second conductive region configured to be capacitively coupled to a second RF power generator and an insulation region that electrically insulates the first conductive region from the second conductive region.

A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.

Electronic spindle lock for a power tool. One embodiment provides a power tool including a housing, a bit receiving portion provided on the housing for receiving a power tool bit, a motor within the housing configured to rotate the bit receiving portion, and a controller coupled to the motor. The controller is configured to enter an electronic spindle lock mode, and detect rotation of the bit receiving portion in a first direction. The controller is also configured to control motor to rotate in a second direction in response to detecting rotation of the bit receiving portion in the first direction.

Electronic spindle lock for a power tool. One embodiment provides a power tool including a housing, a bit receiving portion provided on the housing for receiving a power tool bit, a motor within the housing configured to rotate the bit receiving portion, and a controller coupled to the motor. The controller is configured to enter an electronic spindle lock mode, and detect rotation of the bit receiving portion in a first direction. The controller is also configured to control motor to rotate in a second direction in response to detecting rotation of the bit receiving portion in the first direction.