A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.

The invention relates to a drill chuck which has a drilling needle receptacle device for removable receiving of a drilling needle (1), a hollow cylindrical magnetic holder for the drilling needle receptacle device and a coupling device for torque transfer from a drive device to the drilling needle receptacle device. The drilling needle receptacle device, in which a drilling needle (1) having a flattened end section (1) can be received, has a receptacle element (7), at least two clamping bodies (10) and a clamping insert (6). The receptacle element (7) has at least one cylindrical section (72) having a recess (71) and the clamping insert (6) has counter-molded bodies (61) which supplement the clamping bodies (10) and which extend away from a stop disc (62). The stop disc (62) contacts a face of the cylindrical section (72) and has a lead-through opening (63) for the drilling needle (1). The counter-molded body (61) and the clamping bodies (10) are designed in respect of the dimensions and shape thereof for arrangement in the recess (71) and for clamping receiving of the flattened end section (1) of the drilling needle (1) between the clamping bodies (10) and the counter-molded bodies (61). The invention further relates to a drilling needle and to a drilling needle-drill chuck assembly.

An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than a second area of the end face which is different from the first area.

A work holder includes: a first holding part having three attracting members that are arranged circumferentially apart from each other to attract an axial end face of an annular work; and a second holding part having a contacting member that is held in contact with an inner periphery or outer periphery of the work and restricts radial movement of the work.

An electrostatic chuck comprises a ceramic body having a first surface and a second surface that is on an opposite side of the ceramic body to the first surface, the ceramic body comprising a through-hole between the first surface and the second surface. The electrostatic chuck further comprises a thermally conductive base that supports the ceramic body and comprises a second hole that lines up with the through-hole, wherein the second hole is to fluidly couple to a source of heat transfer gas. The electrostatic chuck further comprises a bonding layer between the ceramic body and the thermally conductive base, the bonding layer comprising a space between an opening of the through-hole on the second surface and the gas introduction path.

A method of manufacturing a substrate support assembly comprises bonding a ceramic body to a thermally conductive base. The method further comprises metal bonding a protective layer to the ceramic body, wherein the protective layer is a sintered ceramic article.

Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

An electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, a second major surface, and a through-hole; a metallic base plate which has a gas introduction path that communicates with the through-hole; and a bonding layer which is provided between the ceramic dielectric substrate and the base plate and includes a resin material. The bonding layer has a space which is provided between an opening of the through-hole in the second major surface and the gas introduction path and is larger than the opening in a horizontal direction, and a first area in which an end face of the bonding layer on a side of the space intersects with the second major surface being recessed from the opening further than a second area of the end face which is different from the first area.

A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article.

Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.