An ink-printed substrate comprising a substrate and water-based ink composition printed on the substrate, wherein the ink-printed substrate has an average color density of at least about 0.48 or greater.

Generally, the present invention provides methods for the production of materials comprising a plurality of nanostructures such as nanotubes (e.g., carbon nanotubes) and related articles. The plurality of nanostructures may be provided such that their long axes are substantially aligned and, in some cases, continuous from end to end of the sample. For example, in some cases, the nanostructures may be fabricated by uniformly growing the nanostructures on the surface of a substrate, such that the long axes are aligned and non-parallel to the substrate surface. The nanostructures may be, in some instances, substantially perpendicular to the substrate surface. In one set of embodiments, a force with a component normal to the long axes of the nanostructures may be applied to the substantially aligned nanostructures. The application of a force may result in a material comprising a relatively high volume fraction or mass density of nanostructures. In some instances, the application of a force may result in a material comprising relatively closely-spaced nanostructures. The materials described herein may be further processed for use in various applications, such as composite materials (e.g., nanocomposites). For example, a set of aligned nanostructures may be formed, and, after the application of a force, transferred, either in bulk or to another surface, and combined with another material (e.g., to form a nanocomposite) to enhance the properties of the material.

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.- %, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.

This disclosure relates to methods that include depositing a first component and a second component to form a film including a plurality of nanostructures, and coating the nanostructures with a hydrophobic layer to render the film superhydrophobic. The first component and the second component can be immiscible and phase-separated during the depositing step. The first component and the second component can be independently selected from the group consisting of a metal oxide, a metal nitride, a metal oxynitride, a metal, and combinations thereof. The films can have a thickness greater than or equal to 5 nm; an average surface roughness (Ra) of from 90 to 120 nm, as measured on a 5 μm×5 μm area; a surface area of at least 20 m.sup.2/g; a contact angle with a drop of water of at least 120 degrees; and can maintain the contact angle when exposed to harsh conditions.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

A composition, utility material, and method of making a utility material is disclosed. A composition having an improved setting time may include a plurality of microparticles mixed with a sodium silicate binder and an isocyanate setting agent, where the microparticle composition has a setting time of less than or equal to one hour. A utility material may be a wallboard that includes the composition.

Provided herein is a composition comprising from 50% to 60% polysiloxane consisting essentially of polyphenylmethylsiloxane and α,ω-methoxy-terminated polydimethylsiloxane, from 40% to 50% organic solvent, from 2% to 4% polysilazane, and polysilane of a formula (R.sub.1R.sub.2Si).sub.n, wherein n is greater than 1, and wherein R.sub.1 and R.sub.2 are the same or different and are alkyl, alkenyl, cycloalkyl, alkylamino, aryl, aralkyl, or alkylsilyl. The composition, after curing, is a flame resistant binder for forming a composition-fiber composite that withstands repeated temperatures over 1800° F. The composition may further comprise from 0.1% to 2% of an enhancer selected from butyltitanate and aminoethylaminopropyltrimethoxysilane (H.sub.2NC.sub.2H.sub.4NHC.sub.3H.sub.6—Si(OCH.sub.3).sub.3). The composition may be mixed with fibers in a ratio of 35:65 to 45:55 (w/w), and the composition-fiber mixture may be cured under vacuum at a temperature of 200° F. to 450° F. for 30 minutes to 180 minutes to form a composite.

In some embodiments, a molding packaging material includes an outer side base layer made of a heat resistant resin, an inner sealant layer, a metal foil layer arranged between the outer side base material layer and the inner sealant layer, and a matte coat layer formed on a side opposite to a metal foil layer side of the outer side base material layer. The matte coat layer includes a resin component, a solid fine particle, and a lubricant, and the inner sealant layer includes a thermoplastic resin and a lubricant.

The present invention relates to the use of coating compositions, comprising shaped transition metal, especially silver, particles and a binder, wherein the ratio of pigment to binder is preferably such that the resulting coating shows an angle dependent color change, for the production of security elements and holograms. When the coating compositions of the present invention are used in coating a hologram the obtained products show a an angle dependent color change (flip/flop effect), different colors in reflection and transmission, an extremely bright OVD image and extremely strong rainbow effect, high purity and contrast.