An organic photoelectronic device includes a first electrode and a second electrode facing each other and a light-absorption layer between the first electrode and the second electrode and including a photoelectric conversion region including a p-type light-absorbing material and an n-type light-absorbing material and a doped region including an exciton quencher and at least one of the p-type light-absorbing material and the n-type light-absorbing material, wherein at least one of the p-type light-absorbing material and the n-type light-absorbing material selectively absorbs a part of visible light, and an image sensor includes the same.

A display device includes a substrate including a display configured to display an image and a non-display area disposed on at least one side of the display area. A plurality of pixels is disposed in the display area. An organic insulating layer is disposed on the substrate. A pixel defining layer is disposed on the organic insulating layer. A sealing layer at least partially covers the display area and the non-display area and includes an inorganic material. The organic insulating layer and the pixel defining layer have a valley disposed therein. The valley is formed by removing portions of the organic insulating layer and the pixel defining layer along a circumference of the display area.

A display panel is provided. The display panel comprises an array substrate including a substrate and a plurality of pixel units disposed on the substrate, wherein each pixel unit includes a light emitting structure and a pixel driver circuit, the light emitting structure includes a reflective electrode, the driver circuit is disposed on a side of the light emitting structure adjacent to the substrate, the pixel driver circuit includes at least two thin-film-transistors and at least one capacitor, and orthogonal projections of at least two thin-film-transistors and at least one capacitor on a plane where the reflective electrode is located fall within the reflective electrode; a fingerprint recognition module including at least one fingerprint recognition unit, wherein an orthogonal projection of the fingerprint recognition unit on the array substrate at least partially overlaps with a transparent region on the array substrate; and a fingerprint recognition light source.

An optoelectronic device includes a flexible organic light-emitting diode having a main extension plane, a first retaining element having a first major surface formed in accordance with a bent surface, and a second retaining element, wherein the OLED is arranged between the first retaining element and the second retaining element, and the OLED is mechanically fixed by the first retaining element and/or the second retaining element such that the main extension plane of the OLED is formed in accordance with the bent surface.

The present invention relates to a compound of the formula (I), (II) or (III), to the use of the compound in an electronic device, and to an electronic device comprising a compound of the formula (I), (II) or (III). The present invention furthermore relates to a process for the preparation of a compound of the formula (I), (II) or (III) and to a formulation comprising one or more compounds of the formula (I), (II) or (III).

The present invention relates to formulations comprising at least one organic semiconductor and at least one organic solvent, characterized in that the formulation contains less than 10,000 particles per liter formulation having an average size in the range from 0.1 to 20 μm, to their use for the preparation of electronic devices, to methods for preparing electronic devices using the formulations of the present invention, and to electronic devices prepared from such methods and formulations.

The present disclosure provides a display substrate, comprising: a bending resistant region; the region comprises a base and a metal wire layer, wherein the metal wire layer is directly formed on the base, or the region further comprises an organic buffer layer located between the base and the metal wire layer, and the metal wire layer is directly formed on the organic buffer layer. The present disclosure provides a method for manufacturing the display substrate above-described. The present disclosure further provides a display device, comprising the display substrate above-described. The present disclosure further provides a method for manufacturing the display device, comprising the method for manufacturing the display substrate above-described. The present disclosure forms a bending resistant structure in a predetermined bending resistant region on the bezel portions of the display substrate, which can enhance the bend resistance thereof and improve the quality of the flexible display.

A bendable stack assembly that includes a glass element having a composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, a final thickness from about 20 μm to about 100 μm, a first primary surface substantially in tension upon a bending of the element, and a second primary surface substantially in compression upon the bending, the primary surfaces characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness. The glass element also includes a protect layer on the first primary surface. In addition, the glass element is characterized by an absence of failure when the element is held during the bending at a bend radius of about 15 mm for at least 60 minutes at about 25 C and about 50% relative humidity.

A flexible display device and an electronic device, applied to the technical field of display, are provided and aim at solving the technical problem in the related art that a driving IC is prone to rupture and/or breakage following bending of a flexible display panel. The flexible display device may include a flexible display panel, a flexible circuit board, and a driving IC. The flexible circuit board may include a body portion including an element arrangement region and a reserved region, and a connecting portion protruding from the reserved region and extending toward the flexible display panel, and is connected to the flexible display panel. A separation space is defined among the body portion, the connecting portion, and the flexible display panel. The driving IC is electrically installed in the element arrangement region.

Disclosed are conjugated polymers based on terthiophene. Such polymers exhibit good solubility and great solution processibility, and that enable highly efficient OPVs.