Y10S156/941

METHOD AND APPARATUS FOR PRODUCING FLEXIBLE OLED DEVICE
20200184858 · 2020-06-11 ·

After an intermediate region and a flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and a glass base is irradiated with laser light. The multilayer stack is separated into the first portion and the second portion while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and the intermediate region. The step of irradiating with the laser light includes forming the laser light from a plurality of arranged laser light sources and temporally and spatially modulating a power of the plurality of laser light sources according to a shape of the flexible substrate region of the synthetic resin film.

Substrate separation system and method

A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

SUBSTRATE SEPARATION SYSTEM AND METHOD
20200105716 · 2020-04-02 ·

A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

Method and apparatus for producing flexible OLED device

After an intermediate region and a flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and a glass base is irradiated with laser light. The multilayer stack is separated into the first portion and the second portion while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and the intermediate region. The step of irradiating with the laser light includes forming the laser light from a plurality of arranged laser light sources and temporally and spatially modulating a power of the plurality of laser light sources according to a shape of the flexible substrate region of the synthetic resin film.

Method for handling a product substrate and a bonded substrate system

A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

Separation apparatus and separation method for flexible display panel

The present application provides a separation apparatus for a flexible display panel, includes a support post, a power unit and a vacuum suction block; wherein the supporting post is used to support the separation apparatus on the relatively upper side of the rigid substrate to be separated; the vacuum suction block is in communication with the support post, and is used to suck and connect the rigid substrate to be separated; and one end of the power unit is connected to the support post, the other end is rotatably connected with the vacuum suction block, and is used for controlling the vacuum suction block and the rigid substrate to be separated together to be separated from the flexible display panel. The present application also provides a method for separating a flexible display panel.

METHOD AND APPARATUS FOR PRODUCING FLEXIBLE OLED DEVICE
20190392736 · 2019-12-26 ·

According to a flexible OLED device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a muitilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with the stage (210). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The step of irradiating with the laser light includes forming the laser light from a plurality of arranged laser light sources and temporally and spatially modulating a power of the plurality of laser light sources according to a shape of the flexible substrate region of the synthetic resin film such that the irradiation intensity of the laser light for at least part of the interface between the intermediate region (30i) and the glass base (10) is lower than the irradiation intensity of the laser light for the interface between the flexible substrate region (30d) and the glass base (10).

APPARATUS OF SEPARATING FLEXIBLE PANEL FROM GLASS SUBSTRATE AND METHOD THEREOF

An apparatus of separating a flexible panel from a glass substrate is provided. The apparatus of separating a flexible panel from a glass substrate includes a console, a movable object fixing table, a position catcher, a lifting platform, and a suction separator. The console respectively drives the movable object fixing table and the lifting platform to move to a first position and a second position according to a real-time position of a fixed object fixed on the movable object fixing table captured by the position catcher, and a adhesive element of the suction separator tightly attaches to the flexible panel of the fixed object fixed on the movable object fixing table, drives the lifting platform to move to a direction away from the movable object fixing table, and drives the movable object fixing table to move to a direction away from the suction separator to separate the flexible panel from the glass substrate of the fixed object and fix the flexible panel on the adhesive element. By practice of the disclosure, the flexible panel could be completely separated from the glass substrate, and the flexible panel and the glass substrate will not be damaged.

Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack
10475672 · 2019-11-12 · ·

A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.

Device for delaminating laminate, delamination method, and method for manufacturing electronic device

A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substrate 2 along the direction in which delamination progresses.