Y10T29/4935

Process for installing an insert for fluid-flow-through cooling of circuit boards

A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

TITANIUM-BASED THERMAL GROUND PLANE

Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.

Modular LNG production facility

A liquefied natural gas production facility and a method of designing and constructing a liquefied natural gas production facility are described. The facility includes space-apart modules for installation at a production location to form a production train including a major axis and a minor axis, each module including a module base for mounting a plurality of plant equipment associated with a selected function assigned to the module, the module base including a major axis and a minor axis. Heat exchangers are arranged to run parallel to the major axis of the production train to form a heat exchanger bank including a major axis and a minor axis, where the major axis of the bank is parallel to the major axis of the train. A subset of the plurality of heat exchangers is arranged on a first level vertically offset from the base of at least one module.

Wireless energy transfer resonator thermal management

Described herein are improved configurations for a wireless power transfer. Described are methods and designs to reduce and manage heating and heat dissipation in resonator structures. Configuration and orientation of magnetic material as well as heat sinking material with respect to the dipole moment of the resonator is used to reduce and control thermal properties of the resonator structure and reduce the effects of heating on the performance of wireless power transfer.

Heat exchanger element, manufacturing method therefor, and heat exchanger

A heat exchanger element includes at least two honeycomb structures arranged serially and each including a cell structural portion having cells separated and formed by partition walls containing SiC and functioning as passages which extend from one end face to the other end face and which a first fluid passes through, and an outer peripheral wall disposed on the outer periphery of the cell structural portion. The first fluid passes through the cells of the honeycomb structures without leaking out of the cells or mixing. The cell structural portions of at least a pair of the honeycomb structures adjacent to each other among the honeycomb structures arranged serially are disposed with a gap, and the first fluid passing through the cells mixes together between end faces forming the gap.

Modular air cooled condenser apparatus and method

Modular air cooled condenser apparatus and related methods are disclosed. An example mechanical draft modular air cooled condenser includes a first condenser bundle having a set of tubes arranged parallel to each other in a first plane that is inclined by an angle with respect to the horizontal; a second condenser bundle having a set of tubes arranged parallel to each other in a second plane that is inclined by an angle (180-) with respect to the horizontal; a third condenser bundle having a set of tubes arranged parallel to each other in a third plane that is inclined by an angle with respect to the horizontal; a fourth condenser bundle having a set of tubes arranged parallel to each other in a fourth plane that is inclined by an angle (180-) with respect to the horizontal; and a fan to create a draft to flow over the condenser bundles.

Heat exchanger having an interference rib
10518367 · 2019-12-31 · ·

One aspect of this disclosure provides a heat exchanger that comprises a first panel half coupled to a corresponding second panel half that form a passageway having at least a first chamber adjacent an inlet end of the passageway and a second chamber and overlapping interference patterns formed in each of the first and second panel halves that extend along at least a portion of the length of the passageway and located between at least the first and second chambers.

Indirect evaporative cooling heat exchanger
RE047783 · 2019-12-31 · ·

A heat exchanger including a header having a plurality of header openings with rigid tubes that may be made of plastic are inserted in the openings. The tubes are sealed to the header to prevent leakage between the header and the tubes to prevent water and air leakage between the wet, scavenger air stream flowing through the tubes and a dry air stream flowing around the tubes. A method of making the heat exchanger includes providing the openings with a flange and uses an interference fit between the rigid heat exchange tubes and the header openings. A self-leveling sealant may be used to seal the heat exchanger tubes to the header using, for example, a paint roller and/or a paint sprayer.

Method for manufacturing heat exchanger plate and method for friction stir welding

Certain embodiments relate to a heat exchanger plate capable of performing friction stir welding at a deep position of the heat exchanger plate, and improving air-tightness and water-tightness. A method may include a lid groove closing process to insert a lid plate into a lid groove formed at a periphery of a concave groove opening to a surface of a base member. The method may also include a primary joining process to perform friction stirring while relatively moving a primary joining rotary tool equipped with a stirring pin along a butting portion of a side wall of the lid groove and a side surface of the lid plate. In the primary joining process, the rotating stirring pin may be inserted into the butting portion, and the friction stirring may be performed in a state of only the stirring pin being in contact with the base member and the lid plate.

Method for manufacturing a structural surface heat exchanger for a nacelle

A method for manufacturing a structural surface heat exchanger of preset or left-hand final shape for an aircraft includes the steps of forming, shaping and assembling, by welding or brazing, a first corrugated skin and a second smooth skin in order to obtain channels. Each channel is delimited by a corrugation of the first skin and the second smooth skin so as to form a structural surface heat exchanger of preset or left-hand final shape, wherein a fluid is configured to circulate in the channels and air is configured to circulate in contact with the second smooth skin.