In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.

Systems and methods are provided for a rotational wire transport. In certain examples, the rotational wire transport may be a part of a wire processing system. The rotational wire transport may include a winding spool, a linear actuator, a cam, and a gripping tab. The rotational wire transport may be configured to wind wire into a coil and move between a plurality of different stations within the wire processing system.

An electrical terminal applicator system includes a die connected to a press. A one-piece member including a stock guide portion is homogeneously connected to a tool receiving portion. The one-piece member is releasably secured to the die using a first fastener. A male member extends from the one-piece member, and a female slot is created in the die slidably receiving the male member to permit the one-piece member to be horizontally positioned on the die prior to securing the one-piece member using the single fastener. A tool assembly having a tool mount block is movable to a desired position. The tool assembly is releasably secured to the tool receiving portion using a second fastener after positioning the tool assembly in the desired position.

This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

An assembly apparatus (10) is provided. The assembly apparatus (10) includes a first feeding mechanism (12) arranged in use to feed a series of first components (14), a holding mechanism (16) arranged in use to hold consecutive ones of the first components (14) in place, a cutter (18) arranged in use to separate individual ones of the first components (14) while being held in place by the holding mechanism (16), an inserter (20) arranged in use to push a separated first component (14) into a corresponding opening in a second component (22), and a drive mechanism (24) coupled to each of the first feeding mechanism (12), the holding mechanism (16), the cutter (18) and the inserter (20). The drive mechanism (24) is arranged in use to synchronize movement of the first feeding mechanism (12), the holding mechanism (16), the cutter (18) and the inserter (20).

This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Disclosed are field-terminable traceable (e.g., networking) cables and cable components (e.g., field-applicable connection hoods), as well as related kits and methods. For example, in one embodiment of a field-applicable connection hood for a networking cable, the connection hood comprises: a connector or plug configured to be coupled to a port or outlet; two conductive tabs each configured to be coupled without, soldering to a tracer wire to enable electrical communication between the tracer wire and the conductive tab; an electrically activated telltale; and a switch configured to be actuated to enable electrical communication between the two conductive tabs and the telltale.

A terminal manufacturing apparatus includes a pressing device adapted to form a chained terminal including a crimp portion by bending a continuously supplied plate-shaped workpiece into a hollow shape, the crimp portion being crimpable with a conductor part of a coated conductor accommodated therein, a welding device adapted to bring two edge portions of the crimp portion in proximity to each other and join the two edge portions by welding, a conveying/positioning time calculating unit adapted to determine a conveying/positioning time of the welding device on the basis of a machining time required by the pressing device and the welding device, and a conveying/positioning mechanism adapted to position the chained terminal in a welding machining position within the welding device in accordance with the conveying/positioning time.

This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Systems and methods are provided for a rotational wire transport. In certain examples, the rotational wire transport may be a part of a wire processing system. The rotational wire transport may include a winding spool, a linear actuator, a cam, and a gripping tab. The rotational wire transport may be configured to wind wire into a coil and move between a plurality of different stations within the wire processing system.