A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

A keypad bezel for attaching to a housing of a handheld computer comprises a main body including plurality of screw holes and tabs for connecting the main body to the computer housing and a plurality of leverage points in the main body useful for removing the keypad bezel from the housing. To remove the keypad bezel, the screws are removed from the screw holes and a removal tool is positioned so that it mates with recesses the keypad bezel and force is applied to the removal tool in a direction way from the housing. The force removes the tabs out of corresponding slots in the housing allowing the bezel to be removed.

A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

A keypad bezel for attaching to a housing of a handheld computer comprises a main body including plurality of screw holes and tabs for connecting the main body to the computer housing and a plurality of leverage points in the main body useful for removing the keypad bezel from the housing. To remove the keypad bezel, the screws are removed from the screw holes and a removal tool is positioned so that it mates with recesses the keypad bezel and force is applied to the removal tool in a direction way from the housing. The force removes the tabs out of corresponding slots in the housing, allowing the bezel to be removed.

The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.

According to one aspect, an apparatus includes an expansion element, an expandable element, and a frame. The expandable element is configured to have an expanded state and an unexpanded state, wherein the expandable element is arranged to be inserted between a mated pair of printed circuit boards (PCBs) while in the unexpanded state. The expansion element is arranged to cause the expandable element to expand to the expanded state. When the expandable element is in the expanded state, the expandable element causes the pair of PCBs to demate. The frame is arranged to facilitate an insertion of the expandable element between the mated pair of PCBs. In one embodiment, the expandable element is an inflatable element and the expansion element is an inflator element that includes an air supply.

A shielding cover mounting and dismounting apparatus for mounting or dismounting a shielding cover connected with a circuit board. The circuit board has an upper surface and a lower surface, and the shielding cover is connected with the lower surface. The apparatus includes a base, a first supporting seat, a second supporting seat, a heater and a moving seat. The first supporting seat is disposed on the base and has a bearing cavity. The shielding cover and the circuit board are disposed in the bearing cavity, and the shielding cover is disposed between the circuit board and a bottom surface of the bearing cavity. The second supporting seat is disposed in an opening of the bearing cavity. The heater is disposed at one side of the upper surface of the circuit board. The moving seat drives the heater to move closer to or away from the circuit board.

Method for removing U-shaped winding elements for an electromagnetically excitable core of an electric rotation machine from a setting tool, wherein the U-shaped winding elements are set and are initially located in the setting tool, wherein in one step the winding elements are partially lifted out from the setting tool, so that parts of rod sections of the winding elements are freely accessible from the outside, characterized in that the winding elements are removed from the setting tool by means of a removal device, by gripping the rod sections.

A method is presented for remote installation or removal of circuit breakers using a remote racking tool outside the arc flash zone of the circuit breakers. The remote racking tool has a drive assembly, remote control assembly, and radio remote pendant station. The remote racking enables operators to install or remove circuit breakers in switchgear or equipment rooms safely away from the arc flash zone.

An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.