A system and method for dismantling components of electronic media electronic storage devices such as hard disk drives, solid state drives and hybrid hard drives. The components are dismantled in a nondestructive manner so as to be capable of reuse. First devices loosen the various components of the storage device, Second devices are provided for removing components from the storage device. A holding chassis receives the storage device, and moves the storage device for engagement with the first and second devices. A mechanism may be provided for destroying the data containing portion of the electric storage device when it is removed from the storage device. A database of information concerning past and current storage devices including their configurations, component locations and screw/fastener locations is provided along with a scanning system for retrieving information about the storage device being introduced into the system. The scanned information and information from the database is used to control and position the first and second devices and holding chassis.

A system for disassembling a drive pinion assembly of a starter motor is disclosed. The drive pinion assembly includes a drive gear and a pinion member coupled to the drive gear through a mounting hole defined in the drive gear. The system includes a base member for supporting the drive pinion assembly. The base member includes a through hole to align with the mounting hole of the drive gear. The system further includes a pin member slidably received in the through hole and an actuating member disposed around the base member. The actuating member is rotatable about a rotational axis defined by the base member. The actuating member includes a cam lobe for moving the pin member towards the mounting hole of the drive gear based on movement of the actuating member about the rotational axis to disassemble the pinion member from the drive gear.

A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

An apparatus for removing cables is provided. The apparatus includes a worktable. An upper surface of the worktable is used to fix at least one motherboard separately. Each motherboard includes a cable fixed thereon. The apparatus includes a feeding assembly, a driving assembly and a removing assembly. The driving assembly and the removing assembly are located on the feeding assembly. The feeding assembly is used to drive the driving assembly and the removing assembly to move to a pre-defined position. The driving assembly is used to drive the removing assembly to remove the cable from the motherboard.

A facility (1) processes multi-core cable (2) having a screening braid and/or foil sheathing, inner conductors (2a), and/or internal filler. The facility (1) includes stations (3, 5-10, 12) each for at least one respective processing step of cable stripping; the opening up, trimming, and folding back of any screening braid present; the removal of any foil present; and the removal of any internal filler present. A transport device transports cut-to-length cables to and from these stations (3, 5-10, 12). The transport system (13) connects stations (3, 5-10, 12). At least one control unit (17) may be provided, whereby all stations (3, 5-10, 12) may be automatically operated.

A hard disk drive desledder comprises a support and a cutting member. The support is configured to receive and to support a hard disk drive assembly that includes a hard disk drive and a sled. The cutting member has at least two cutting edges corresponding to respective portions of the sled. The cutting member is movable from a first position spaced apart from the support and a second position adjacent the support to cause the at least two cutting edges to cut portions of the sled to allow the hard disk drive to be removed from the hard disk drive assembly. Related desledding methods are also described.

An illustrative wire processing machine includes at least one blade configured for at least one of cutting a conductor or at least piercing an insulation layer on the conductor. At least one gripper assembly includes a gripper configured to at least temporarily grasp a portion of a conductor during a wire processing operation. A generator, which is part of the gripper assembly, is configured to radiate a field toward a conductor. The gripper assembly also includes a detector that is configured to detect at least some of the field propagated along the conductor. A processor is configured to determine when a change in the propagated field detected by the detector indicates contact between a conductor and the blade.

A method for extracting electronic components comprising the steps of heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface of the electronic device and disturbing the electronic device to separate the one or more electronic components from the electronic device.