An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

According to one aspect, an apparatus includes an expansion element, an expandable element, and a frame. The expandable element is configured to have an expanded state and an unexpanded state, wherein the expandable element is arranged to be inserted between a mated pair of printed circuit boards (PCBs) while in the unexpanded state. The expansion element is arranged to cause the expandable element to expand to the expanded state. When the expandable element is in the expanded state, the expandable element causes the pair of PCBs to demate. The frame is arranged to facilitate an insertion of the expandable element between the mated pair of PCBs. In one embodiment, the expandable element is an inflatable element and the expansion element is an inflator element that includes an air supply.

Apparatuses, fixtures, methods, and computer program products for disassembling devices are provided. A disassembly apparatus may include first and second disassembly fixtures and an actuator configured to provide a separation force therebetween. Suction may be employed to respectively engage first and second separable portions of a device with the first and second fixtures. Channels defined in an engagement member and surrounded by a sealing member may facilitate such engagement. Further heaters may be employed to loosen a pressure sensitive adhesive or other bonding material.

A shielding cover mounting and dismounting apparatus for mounting or dismounting a shielding cover connected with a circuit board. The circuit board has an upper surface and a lower surface, and the shielding cover is connected with the lower surface. The apparatus includes a base, a first supporting seat, a second supporting seat, a heater and a moving seat. The first supporting seat is disposed on the base and has a bearing cavity. The shielding cover and the circuit board are disposed in the bearing cavity, and the shielding cover is disposed between the circuit board and a bottom surface of the bearing cavity. The second supporting seat is disposed in an opening of the bearing cavity. The heater is disposed at one side of the upper surface of the circuit board. The moving seat drives the heater to move closer to or away from the circuit board.

A tool for installation and removal of a connector of a gas-insulated switchgear termination includes a housing defining an operation chamber therein, a mounting assembly selectively disposed in the operation chamber of the housing and adapted for securely installing a sleeve member of a gas-insulated switchgear termination on a conical connector member of the gas-insulated switchgear termination or removing the sleeve member securely sleeved on the conical connector member from the conical connector member, an actuator assembly adapted for actuating motion of the mounting assembly, and a friction reducing assembly adapted for reducing friction and resistance occurring during the motion of the mounting assembly.

A system for removing a plurality of connectors from a circuit board includes two clamp plates. The system includes a divider plate coupled between the two clamp plates. The divider plate is configured to be positioned between adjacent rows of the plurality of connectors. The system further includes a tightening mechanism to tighten the clamp plates and the plurality of pin plates around the plurality of connectors. The system also includes an ejector coupled to the divider plate. The ejector includes a slot that corresponds to a projection on the divider plate, and the divider plate is configured to slide relative to the ejector.

A removal apparatus includes a main body, a carrying device, a heating device and a brush device. The carrying device is disposed on the main body, and includes a holding module for holding a circuit board. The heating device is disposed on the main body for heating up the circuit board to melt bonding material that bonds electronic components and a board body of the circuit board. The brush device is disposed on the main body, and includes at least one brush body that is made of heat-resistant material, and that is operable to move relative to a surface of the circuit board to remove the electronic components from the board body after the bonding material are melted.

A system for disassembling a drive pinion assembly of a starter motor is disclosed. The drive pinion assembly includes a drive gear and a pinion member coupled to the drive gear through a mounting hole defined in the drive gear. The system includes a base member for supporting the drive pinion assembly. The base member includes a through hole to align with the mounting hole of the drive gear. The system further includes a pin member slidably received in the through hole and an actuating member disposed around the base member. The actuating member is rotatable about a rotational axis defined by the base member. The actuating member includes a cam lobe for moving the pin member towards the mounting hole of the drive gear based on movement of the actuating member about the rotational axis to disassemble the pinion member from the drive gear.

Disclosed is an apparatus for detaching a component from a mounting surface to which the component is attached by an adhesive. The apparatus includes a right-angled hook, a curved hook, a connecting body and an adjusting member. On one side of the component, the right-angled hook protrudes into a first space between the component and the mounting surface. On another side of the component, the curved hook protrudes into a second space between the component and the mounting surface. The connecting body connects the right-angled hook and the curved hook. In response to a thermal process, the adhesion of the adhesive is reduced, and an adjustment of the adjusting member allows the curved hook to provide a shear force in order to detach the component from the mounting surface. A method for detaching a component from a mounting surface is also disclosed.