A label assembly including one or more dissolvable thermal direct adhesive labels and methods of assembly and use. According to one embodiment, each label includes a base layer, a thermal direct layer, an adhesive layer, and a barrier layer. The base layer, which has an upper surface and a lower surface, is water-dissolvable and may be made of a water-dissolvable paper. The thermal direct layer is positioned directly over the upper surface of the base layer and functions in the conventional manner to produce markings therein in response to heat. The adhesive layer is water-dissolvable and is positioned below the lower surface of the base layer. The barrier layer, which is positioned directly below the lower surface of the base layer and directly over the adhesive layer, serves to prevent migration of the adhesive layer through the base layer and into contact with the thermal direct layer.

The method of manufacturing a light control element of the present invention includes: removing, in a predetermined portion of a light control film including a first base material with a transparent electrode layer and a second base material with a transparent electrode layer arranged so that transparent electrode layers are opposed to each other, and a liquid crystal light control layer sandwiched between the base materials with transparent electrode layers, one of the base materials with transparent electrode layers; swelling the liquid crystal light control layer remaining in the predetermined portion after the removal of the one of the base materials with transparent electrode layers with an organic solvent; bonding a pressure-sensitive adhesive tape to a surface of the swollen liquid crystal light control layer; and peeling off the pressure-sensitive adhesive tape from the light control film together with the swollen liquid crystal light control layer.

The present invention relates to a peeling device of sheet material for peeling off graphite, and the peeling device of sheet material according to the present invention is characterized in that a specific microchannel is used to apply a shear force required to peel off graphite, and simultaneously, graphene itself is not ground and the discharge flow rate of the graphene dispersion increases to increase graphene preparation efficiency.

A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

A method of recovering structural members from a used absorbent article comprising a front sheet, a back sheet and an absorbent body between the front sheet and the back sheet, wherein at least one of the front sheet and the back sheet includes a film, and wherein the absorbent body includes an absorbent body material, may include swelling the used absorbent article with water, applying a physical shock to and disintegrating the swelled used absorbent article into at least the film and the absorbent body material, and separating the film and the absorbent body material.

Disclosed is a thin subject assisted debonding method for separating temporarily bonded workpiece-carrier pair. The thin subject can be a thin wire, or thin filament, or thin blade. The thin subject can be applied between the workpiece and carrier pair in association with laser debonding or mechanical debonding to provide well controlled and targeted wedging function to the delaminating temporary adhesive and its adjacent substrate to which it is separating from. The workpiece can be a semiconductor wafer that has been thinned and processed, and the carrier can be a semiconductor non-device wafer or any other rigid substrate such as a glass wafer or panel. The application of a thin subject between the workpiece and carrier during debonding provides the advantage of high throughput and low defect rate.

A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

A peeling device includes a peeling tank for containing a first solution therein, a support portion on which a stack structure including a base layer extending in a first direction and a film coupled with the base layer is disposed, the support portion being disposed in the peeling tank and an adsorption device for adsorbing the base layer thereon to peel off the base layer from the film, the adsorption device including an adsorption portion for adsorbing the base layer, and a moving portion coupled with the adsorption portion for moving the adsorption portion to allow the base layer to be bent to a second direction crossing the first direction and to be peeled off from the film.

A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.