Disclosed is a thin subject assisted debonding method for separating temporarily bonded workpiece-carrier pair. The thin subject can be a thin wire, or thin filament, or thin blade. The thin subject can be applied between the workpiece and carrier pair in association with laser debonding or mechanical debonding to provide well controlled and targeted wedging function to the delaminating temporary adhesive and its adjacent substrate to which it is separating from. The workpiece can be a semiconductor wafer that has been thinned and processed, and the carrier can be a semiconductor non-device wafer or any other rigid substrate such as a glass wafer or panel. The application of a thin subject between the workpiece and carrier during debonding provides the advantage of high throughput and low defect rate.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20? C. to 90? C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.

The invention relates to the use of mixtures of water and essential oils selected from the group consisting of phenols, phenylpropanoids and furanocoumarins, for separating multilayered composites for the segregated recycling of polymer/metal films.

The present invention discloses a separating device for a bonded cine film and a method therefor, which belong to the field of image file protection and repair technologies. The separating device comprises a pressurizing device, a separating device and a liquid nitrogen storage device; the pressurizing device is connected to the liquid nitrogen storage device for providing a pressure thereto; the liquid nitrogen storage device is connected to the separating device for providing liquid nitrogen thereto; the separating device is provided therein with a film receiving chamber for accommodating a film to be separated; the pressurizing device pressurizes the liquid nitrogen storage device to allow the liquid nitrogen to enter the film receiving chamber; due to a difference between expansion coefficients of a base layer and an emulsion layer of the film under a low temperature, micro-pores and gaps may be generated in the base layer and the emulsion layer of a bonded film roll; the liquid nitrogen penetrates into the micropores and gaps of the bonded film roll, a certain tension is generated during gasification, and viscosity of liquefied gelatin decreases under the low temperature, thereby achieving the purpose of separation; the entire separation process does not damage the pH, dimensional stability or mechanical properties of the film roll, and a non-destructive separation can be achieved.

The present invention relates to a method for transferring two-dimensional nanomaterials. The method comprises the following steps: S1, providing a first substrate and a two-dimensional nanomaterial layer on a surface of the first substrate; S2, covering the two-dimensional nanomaterial layer with a carbon nanotube film structure; S3, obtaining a composite structure comprising the two-dimensional nanomaterial layer and the carbon nanotube film structure by removing the first substrate with a corrosion solution; S4, cleaning the composite structure by placing the composite structure on a surface of a cleaning solution; S5, picking up the composite structure from the cleaning solution with a target substrate, by contacting the target substrate with the two-dimensional nanomaterial layer of the composite structure; and S6, removing the carbon nanotube film structure from the composite structure.

The present invention provides a method of promoting separation of polymer bonded to a substrate of different material, which collectively form at least part of a polymer composite structure, the method comprising: (1) contacting the polymer composite structure with a composition comprising organic solvent which is absorbed within one or both of the polymer and substrate, wherein the composition comprising organic solvent does not dissolve either the polymer or the substrate, and (2) contacting the polymer composite structure provided in step (1) with liquid (i) having a temperature higher than the boiling point of the composition comprising organic solvent used in step (1), and (ii) that does not dissolve either the polymer or the substrate, the action of which promotes separation between the polymer and the substrate.

Systems and methods for debonding a carrier from a semiconductor device are disclosed herein. In one embodiment, a system for debonding a carrier from a semiconductor device includes a support member positioned to carry the semiconductor device and a fluid delivery device having an exit positioned to direct a fluid toward an adhesive layer between the carrier and the semiconductor device. The fluid directed from the fluid delivery device initiates debonding of the carrier from the semiconductor device by weakening or loosening at least a portion of the adhesive. The system further includes a liftoff device configured to releasably engage the carrier and apply a debonding force to the carrier to complete debonding of the carrier from the semiconductor device.

The present invention discloses a method for removing a screen coating film, which comprises: s1. film cutting: the screen coating film is cut at four sides thereof with a cutter, with the cutting depth being the thickness of the coating film; s2. film soaking: the coating film of the screen is soaked in a solution for 4 to 5 hours; s3. re-cutting: the screen coating film is re-cut with the cutter, with the cutting depth being the thickness of the coating film; s4. film tearing: the cut coating film is torn off from the screen; s5. glue cutting: glue that is not torn off on the surface of the screen is cut off with a special cutter; s6. scrubbing and cleaning: the screen is thoroughly cleaned and scrubbed with a detergent; and s7. suck-drying: the detergent remaining on the screen is suck-dried.

Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.