A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer.

An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

According to various embodiments of the present invention, an electronic device comprises: a heating unit, which includes a lower heating unit and an upper heating unit rotatably coupled to the lower heating unit, and heats an external electronic device mounted on at least one surface of the lower heating unit; a fixing unit, which is disposed to be adjacent to the lower heating unit, and has at least one part formed to be movable in the longitudinal direction of the lower heating unit, thereby fixing the external electronic device; a adsorption unit having one part, which is inserted into at least one recess formed on the upper heating unit, and adsorbing at least a region of the external electronic device; and a driving unit, which is disposed at one side or a surrounding part of the heating unit, can move in the direction perpendicular to the moving direction of the fixing unit, and rotates the upper heating unit by pressurizing the same.

The present invention is directed to a method for detaching two substrates bonded by an adhesive, in particular by treating with a debonding agent. In addition, the present invention relates to the use of the method in recycling parts of the electronic devices. The method comprises the steps of: (1) treating two substrates bonded by an adhesive with a debonding agent comprising acetone and/or oleic acid at a temperature from 20° C. to 90° C., and (2) removing the substrates from the adhesive.

A method for separating a window includes providing a display device including a display panel, a window disposed on the display panel and including a color layer. An adhesive layer is disposed between the display panel and the window. Heat is applied to the display device. The method includes inserting a disassembling stick between the display panel and the window to separate an edge of the display panel from the window. The method includes cooling the display device. The method includes separating the display panel and the window from each other.

A disassembling device facilitating a gentle disassembly of components glued together includes a base, a heating plate, a moving member, and a vacuum suction assembly. The disassembling device disassembles and separates portions of an electronic device for post-manufacture analysis or other purposes. The electronic device can disassemble glued parts with speed and high efficiency. By applying suction and sufficient heating to glued-together portions of the electronic device, damages to the electronic device can be avoided.

A disassembling method of a display module includes attaching an auxiliary sheet to a display module by using an adhesive tape, the display module including a display panel attached to a window by an adhesive layer, and the auxiliary sheet attached to the display module including an external force applying portion exposed outside an outer edge of the display module; cooling the display module and the auxiliary sheet attached thereto by the adhesive tape; and after the cooling of the display module and the auxiliary sheet attached thereto, separating the display panel and the window from each other by applying force to the external force applying portion of the auxiliary sheet attached to the display module.

A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.

According to one embodiment of the present invention, a method for dismantling a solar cell module for recycling comprises the steps of: providing a silicon solar cell module in which a silicon solar cell element and one side of glass are bonded together by a sealing agent and a transparent conductive material layer is coated between the side of the glass and the sealing agent; applying a high voltage between the transparent conductive material layer and the other side of the glass; and separating the glass and sealing agent by exposing the silicon solar cell module having the transparent conductive material layer discolored by application of the high voltage to a moisture environment.