Patent classifications
Y10T156/1168
Manufacturing method and manufacturing device of flexible display panel
A manufacturing method and a manufacturing device of a flexible panel are provided. the flexible panel includes a bending area, and the manufacturing method includes: providing a panel unit including a flexible substrate and a back film which are laminated, the panel unit including a panel area corresponding to the flexible panel and a non-panel area outside the panel area; and removing the non-panel area of the panel unit while peeling off a peelable portion of the back film in the bending area of the flexible panel.
Method of dismantling a stack of at least three substrates
A method for disassembling a stack of at least three substrates. The invention relates to the techniques for transferring thin films in the microelectronics field. It proposes a method for disassembling a stack of at least three substrates having between them two interfaces, one interface of which has an adhesion energy and an interface of which has an adhesion energy, with less than, the method comprising: 1) implementing a removal of material on the first substrate, in order to expose a surface of the second substrate, 2) transferring the stack onto a flexible adhesive film so that the surface has, with an adhesive layer of the film, an adhesion energy greater than, and 3) disassembling the third substrate at the interface between the second substrate and the third substrate. The method makes it possible to open the stack via the interface thereof with the highest adhesion energy.
Element pickup device, method for manufacturing the same and method for using the same
The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.
FILM PEELING DEVICE AND METHOD OF PEELING FILM
A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.
Peeling apparatus
A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.
CARRIER PLATE REMOVING METHOD
There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.
Pellicle removal tool
A pellicle removal tool including a stage that holds a photomask and an associated pellicle, two or more arms positioned around the stage and configured to engage pellicle side wells of the pellicle, and two or more actuators each configured to adjust at least a vertical position of a corresponding one of the two or more arms so as to apply a lifting force to the pellicle for removal of the pellicle from the photomask.
Method for separating label assembly
A label assembly including a face sheet, a back sheet, and a layer of an adhesive positioned between the face sheet and the back sheet. A separation line divides the label assembly into at least two portions. The separation line is formed by a first tearable line of separation extending across the back sheet and a second tearable line of separation extending across the face sheet. The first tearable line of separation is offset with respect to the second tearable line of separation, and at least one of the first and second tearable lines of separation includes a non-linear portion directed toward and/or an angled portion extending at an angle to an other of the at least one of the first and second tearable lines of separation.
Method of removing carrier plate
A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.
Peeling device
A peeling device includes a rolling mechanism, a peeling mechanism, and a suction mechanism. The rolling mechanism includes a feeding wheel and a receiving wheel. At least one of the feeding wheel and the receiving wheel is configured to rotate. The peeling mechanism includes a peeling plate including a first surface and a side surface. The suction mechanism includes a support table and a rotary suction cup. A carrier tape is transmitted in sequence around the feeding wheel, the first surface, the side surface, and the receiving wheel. The peeling plate peels the material from the carrier tape at a junction of the first surface and the side surface. The support table holds the material peeled from the carrier tape. The rotary suction cup is used to suck the material from the support table and move the material to a next processing area.